High Density Interconnection and Packaging Chemical Engineering in 21st Century

21世纪高密度互连与封装化学工程

• 批准号: 10555267
• 负责人: KONDO Kazuo
• 金额: $ 7.68万
• 依托单位: OKAYAMA UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1998
• 资助国家: 日本
• 起止时间: 1998 至 1999
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-10555267/
• 关键词: Packaging Chemical Engineering; High Density Inter Connection; Current Distribution; Electrodeposition; Bumping; electronics; 実装プロセス工学; 表面実装化学工学

Electrodeposited bumps are the indispensable micro-connectors for high density interconnection in the latest microelectronics applications. For the higher frequency circuit, shorter interconnection length by bumps in required in order to reduce the reflection noise. Ball grid array (BGA) of solder bumps is necessary for high pin count chips in order to reduce the their packaging size. Bumps can also be used as a new testing method for bare chips of high pin counts. Another application is the interconnection between liquid crystal display (LCD) and driver chips, which are mostly interconnected with tape automated bonding (TAB). The bumps act as micro connectors of TAB technology and conduct digital signals from the chips to the LCD pixels.The bumps are electrodeposited onto the dot shaped cathode of 10 to 200μm in diam. The cathode, or photolithography patterns, are patterned by photomask and photoresist. The control of electrodeposited bump shape, as well as the uniformity in their height, is important for obtaining proper interconnection reliability.The research summarized three topics on shape evolution of bumping. The effect of high aspect ratio cavity for CSP and flip chip, the effect of additive and interference effect of neighbor bumps.Furthermore, we have organized the Packaging Process Engineering Division in the Society of the Chemical Engineering. Forty companies and ten university have already joined our division.

电沉积凸块是最新微电子应用中高密度互连不可或缺的微型连接器，对于更高频率的电路，需要更短的凸块互连长度，以减少焊料凸块的反射噪声。对于高引脚数芯片，以减小其封装尺寸，凸点还可以用作高引脚数裸芯片的新测试方法。驱动芯片，大多通过卷带自动接合（TAB）互连。凸块充当TAB技术的微型连接器，将数字信号从芯片传导到LCD像素。凸块被电沉积到10至200μm的点状阴极上。阴极或光刻图案通过光掩模和光致抗蚀剂进行图案化，控制电沉积凸块形状及其高度的均匀性对于。研究总结了凸块形状演变的三个主题：CSP和倒装芯片的高深宽比空腔的影响、相邻凸块的相加效应和干扰效应。此外，我们还组建了封装工艺工程部门。化学工程学会的 40 家公司和 10 所大学已经加入了我们的部门。

项目成果

Kazuo Kondo, Zennnosuke Tanaka, Munehiro Eguchi and Takuya Monden: "Shape Evolution of Electrodeposited Bumps with Additive and its Application"3rd IEMT/IMC Proceedings. 381. (1999)

Kazuo Kondo、Zennnosuke Tanaka、Munehiro Eguchi 和 Takuy​​a Monden：“添加剂电镀凸块的形状演化及其应用”第 3 届 IEMT/IMC 会议论文集。

石井正人、近藤和夫: "ビルドアップ多層配線板のプロセス工学"日本工業倶楽部. (1999)

Masato Ishii、Kazuo Kondo：“积层多层线路板的工艺工程”，日本工业俱乐部（1999 年）。

Kazuo Kondo Keisuke Fukui: "Current Evolution of Electorodeposited Copper Bumps with Photoresist Angle." Journal of the Electorochemical Society. 145. 840-d842 (1998)

Kazuo Kondo Keisuke Fukui：“采用光致抗蚀剂角的电镀铜凸块的当前演变。”

Kazuo Kondo, Zennnosuke Tanaka, Munehiro Eguchi and Takuya Monden: "Shape Evolution of Bumps with Additive and COD Interconnection"JIEP.

Kazuo Kondo、Zennnosuke Tanaka、Munehiro Eguchi 和 Takuy​​a Monden：“使用添加剂和 COD 互连的凸块形状演变”JIEP。

Kazuo Kondo, Mihoko Uemura, Takako Okuno and Zennnosuke Tanaka: "Shape Evolution of Lead Frame Etching"JAP. Journal of Chemical Engineering. 26. (2000)

Kazuo Kondo、Mihoko Uemura、Takako Okuno 和 Zennnosuke Tanaka：“引线框架蚀刻的形状演变”JAP。