Resuspension of submicron Particles by Various Disturbances

各种干扰使亚微米颗粒重新悬浮

• 批准号: 02650681
• 负责人: EMI Hitoshi
• 金额: $ 1.47万
• 依托单位: Kanazawa University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1990
• 资助国家: 日本
• 起止时间: 1990 至 1991
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-02650681/
• 关键词: Fine Particles; Reentrainment; Pulse air jet; Surface cleaning; Resuspension; Wafer; 飛散; ウエハ; 付着粒子; 飛散実験; 気流速度; ダクト壁; ファンデルワ-ルス力; 流体抵抗; 飛散率

Resuspension of submicron particles from a duct wall by air stream was studied to clarify the detachment mechanisms of fine particles from various tubings and surfaces in clean room. Although the resuspension of particles in clean room leads to the contamination of products, the resuspension phenomena of particles by pulse air jet was investigated to develop dry wafer surface cleaning method. The followings are the main conclusions obtained in the present work.(1) Fine particles with diameter less than 1mum would not be resuspended by a steady air stream with velocity of over 100 m/s, but those which deposited at a bump of the wall or the aggregates of these particles could be detached from the surface at a lower airflow velocity.(2) Abrupt change in airflow velocity leads to particle reentrainment.(3) Sequence of pulse air jets is effective for the removal of fine particles from after surface because particle detachment takes place the moment air jet hits the surface.(4) Continual exposure of wafer surface to air jets brings complete removal of particles with diameter of 0.25mum.(5) Fraction of particles reentrained per pulse of air jet does not change in the sequence of the pulse air jets.(6) Particle removal efficiency from wafer surface by pulse air jets mostly depends on the air pressure rise at the collision of air jet on the surface.

研究了通过空气流从管道壁上重悬的亚微米颗粒，以阐明清洁室中各种管道和表面的细颗粒的分离机制。尽管清洁室中颗粒的重悬于产品中会导致产品污染，但研究了脉冲空气射流的颗粒重悬现象以开发干晶片表面清洁方法。以下是在本工作中获得的主要结论。（1）直径小于1MUM的细颗粒不会被稳定的空气流重悬于100 m/s以上的稳定空气中，但是在墙壁上沉积的那些颗粒或这些颗粒的聚集体沉积的颗粒可以从表面上脱离较低的空气流量。 （3）脉冲空气飞机的序列有效地从后面去除细颗粒，因为粒子脱离发生了矩射击的瞬间撞击表面。（4）晶圆表面持续暴露于晶圆表面以使空气飞机完全去除颗粒，直径为0.25mum的直径为0.25mum。脉冲空气飞机从晶圆表面大部分取决于空气射流在表面上的碰撞时的气压上升。

项目成果

大谷 吉生: "気流による微小粒子の壁からの飛散" エアロゾル研究.

Yoshio Otani：“气流从墙壁上散射微粒”气溶胶研究。

Emi, Hitroshi and Otani, Yoshio: ""Wafer Surface Cleaning by Pulse Air Jet"" Aerosol Science and Technology.

Emi、Hitroshi 和 Otani, Yoshio：““脉冲空气喷射晶片表面清洁””气溶胶科学与技术。

Emi,Hitoshi and Otani,Yoshio: ""Wafer Surface Cleaning by Pulse Air Jet"" Aerosol Science and Technology.

Emi，Hitoshi 和 Otani，Yoshio：““脉冲空气喷射晶圆表面清洁””气溶胶科学与技术。

Emi,Hitoshi and Yoshio Otani: "“Surface Cleaning of Wafer by Pulse Air Jets"" Aerosol Science and Technology.

Emi、Hitoshi 和 Yoshio Otani：““通过脉冲空气喷射对晶圆进行表面清洁””气溶胶科学与技术。