Inter-University Workshop on Next Generation Package Design

下一代包装设计大学间研讨会

• 批准号: 9711762
• 负责人: Madhavan Swaminathan
• 金额: $ 7万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-06-15 至 2000-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9711762&HistoricalAwards=false
• 关键词: Inter; University; Workshop; Next; Generation

9711762 Swaminathan This award is for support for the Inter-University Workshop on Next Generation Package Design. The workshop will result in the identification of: 1) key technical barriers, 2) current university based research status, and 3) major voids that need to be addressed. The results will be published in proceedings and workshop notes. This knowledge gained from this workshop will enable researchers to concentrate research on major technical issues, leverage synergistic research, and identify collaborative activities. The workshop will open to the electronics industry (users of design methods/tools), software industry (developers of design tools), and government organizations to facilitate an open exchange of ideas. The collaboration plan is to use the workshop as a forum to leverage, establish synergy, and strategically coordinate university based research activities. The workshop will help establish partnerships among universities for research and industry for commercialization. These partnerships will then approach key companies and government organizations for support and assistance where needed. The second year workshop will highlight collaboration progress. The result will be a more comprehensive and coordinated plan to address key technical and competitiveness issues associated with next generation package design. A total of five sessions discussing key design issues is planned along with a panel discussion. Engineering Research Centers normally involve studies in research that involves proof-of- concept testbeds. This facility will be the first of its kind in an Engineering Research Center and in a university where the students will have the potential to go beyond proof-of-concept testbeds, to prototype production through a systems-level engineering project. This extends their education from study of concepts to include the effects of manufacturing constraints on their results.

9711762 Swaminathan 该奖项旨在支持下一代封装设计大学间研讨会。 研讨会将确定：1）关键技术障碍，2）当前大学研究现状，3）需要解决的主要空白。 结果将在会议记录和研讨会笔记中发布。 从本次研讨会中获得的知识将使研究人员能够集中研究主要技术问题，利用协同研究并确定协作活动。 该研讨会将向电子行业（设计方法/工具的用户）、软件行业（设计工具的开发者）和政府组织开放，以促进开放的思想交流。 合作计划旨在利用研讨会作为论坛来利用、建立协同作用并战略性地协调大学的研究活动。 该研讨会将帮助大学之间建立研究合作伙伴关系和工业商业化合作伙伴关系。 然后，这些合作伙伴将在需要时向主要公司和政府组织寻求支持和帮助。 第二年的研讨会将重点强调合作进展。 其结果将是一个更全面、更协调的计划，以解决与下一代封装设计相关的关键技术和竞争力问题。 计划举行总共五场讨论关键设计问题的会议以及小组讨论。 工程研究中心通常涉及涉及概念验证测试台的研究。 该设施将是工程研究中心和大学中的第一个此类设施，学生将有可能超越概念验证测试台，通过系统级工程项目进行原型生产。 这将他们的教育从概念研究扩展到包括制造限制对其结果的影响。