Inter-University Workshop on Next Generation Package Design

下一代包装设计大学间研讨会

• 批准号: 9711762
• 负责人: Madhavan Swaminathan
• 金额: $ 7万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-06-15 至 2000-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9711762&HistoricalAwards=false
• 关键词: Inter; University; Workshop; Next; Generation

9711762 Swaminathan This award is for support for the Inter-University Workshop on Next Generation Package Design. The workshop will result in the identification of: 1) key technical barriers, 2) current university based research status, and 3) major voids that need to be addressed. The results will be published in proceedings and workshop notes. This knowledge gained from this workshop will enable researchers to concentrate research on major technical issues, leverage synergistic research, and identify collaborative activities. The workshop will open to the electronics industry (users of design methods/tools), software industry (developers of design tools), and government organizations to facilitate an open exchange of ideas. The collaboration plan is to use the workshop as a forum to leverage, establish synergy, and strategically coordinate university based research activities. The workshop will help establish partnerships among universities for research and industry for commercialization. These partnerships will then approach key companies and government organizations for support and assistance where needed. The second year workshop will highlight collaboration progress. The result will be a more comprehensive and coordinated plan to address key technical and competitiveness issues associated with next generation package design. A total of five sessions discussing key design issues is planned along with a panel discussion. Engineering Research Centers normally involve studies in research that involves proof-of- concept testbeds. This facility will be the first of its kind in an Engineering Research Center and in a university where the students will have the potential to go beyond proof-of-concept testbeds, to prototype production through a systems-level engineering project. This extends their education from study of concepts to include the effects of manufacturing constraints on their results.

9711762 Swaminathan这个奖项是为了支持下一代包装设计的大学间研讨会。 研讨会将导致以下识别：1）关键技术障碍，2）现有大学的研究状况，以及3）需要解决的主要空隙。 结果将发表在会议记录和研讨会上。 从本研讨会中获得的这种知识将使研究人员能够将研究集中在主要技术问题上，利用协同研究并确定协作活动。 该研讨会将向电子行业（设计方法/工具的用户），软件行业（设计工具的开发人员）和政府组织开放，以促进开放的思想交流。 协作计划是将研讨会用作论坛，以利用，建立协同作用和战略性地协调大学的研究活动。 该研讨会将有助于建立研究和行业的商业化的伙伴关系。 然后，这些伙伴关系将在需要时与主要公司和政府组织寻求支持和援助。 第二年的研讨会将重点介绍合作的进步。 结果将是一个更全面和协调的计划，以解决与下一代软件包设计相关的关键技术和竞争性问题。 总共计划了五个会议，讨论关键设计问题以及小组讨论。 工程研究中心通常涉及研究涉及概念证明测试台的研究。 该设施将是工程研究中心中的第一个此类设施，在该大学中，学生将有可能超越概念验证测试台，通过系统级工程项目进行原型生产。 这将他们的教育从对概念的研究扩展到包括制造限制对其结果的影响。