Additive Technology for 3D-Shapeable Millimeter-Wave Passive Components

3D 可成形毫米波无源元件的增材技术

• 批准号: 528098204
• 负责人: Professor Dr. Jan Hesselbarth
• 金额: --
• 依托单位: Professur Hochfrequenztechnik und Allgemeine Elektrotechnik
• 依托单位国家: 德国
• 项目类别: Research Grants
• 资助国家: 德国
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/528098204?language=en
• 关键词: Additive; Technology; 3D; Shapeable; Millimeter

Performance of millimeter-wave passive components, which are needed, for instance, for wireless communication and sensing, is widely influenced by the materials and manufacturing technologies these components are based of. There is a strong need for innovative cost-efficient, high-performant techniques to realize such components. The project aims to explore ground laying aspects for the cost-efficient manufacturing of 3D-shapeable millimeter-wave passive components using additive manufacturing, that is, printing technology. The project will address single-layer and multi-layer manufacturing of 3D-shapeable interconnects and circuits by several different printing technologies. The project will explore the combination of printed dielectric and printed metal structures, together with their requirements and performances for millimeter-wave passive circuit components. It will determine possibilities and limitations of inkjet, dispensing and 3D filament printing. Materials and test structures will be thoroughly investigated with respect to technological usability and millimeter-wave performance. Example structures that will be designed and characterized, for operation between 30 GHz and 140 GHz, will include a variety of transmission lines, antennas and planar-to-waveguide transitions.

毫米波被动组件的性能，例如，对于无线通信和感应，需要这些组件的材料和制造技术广泛影响。强烈需要创新的成本效益，高性能的技术来实现此类组成部分。该项目旨在探索使用增材制造（即印刷技术）的3D易换毫米波被动组件的成本效益制造的地面铺设方面。该项目将通过几种不同的印刷技术来解决3D型互连和电路的单层和多层制造。该项目将探讨印刷介电和印刷金属结构的组合，以及它们对毫米波被动电路组件的要求和性能。它将确定喷墨，分配和3D细丝打印的可能性和局限性。材料和测试结构将在技术可用性和毫米波性能方面进行彻底研究。将设计和表征的示例结构，用于30 GHz至140 GHz之间的操作，将包括各种传输线，天线和平面到波导的过渡。