Multicast chip-to-chip interconnect based on millimeter-wave dielectric waveguide

基于毫米波介质波导的多播芯片间互连

• 批准号: 408428878
• 负责人: Professor Dr. Jan Hesselbarth
• 金额: --
• 依托单位: Institut für Hochfrequenztechnik (IHF)
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2018
• 资助国家: 德国
• 起止时间: 2017-12-31 至 2019-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/408428878?language=en
• 关键词: Multicast; chip; interconnect; based; millimeter

High data-rate inter-chip / intra-chip communication is of growing importance for modern computer systems. Feasible technologies allowing for broadcast / multi-cast transmission with small latency, low attenuation, and reasonable data throughput do not exist. The project aims to develop and to explore the possible performance of a new board-level chip-to-multi-chip interconnect scheme. The technology to be explored in the proposed project alleviates several drawbacks of wired, wireless and optical interconnect techniques. The proposed interconnect uses low-loss dielectric waveguide, low-leakage Y-junctions in dielectric waveguide, and low-loss and compact transitions from on-chip circuit to dielectric waveguide, which in combination results in a feasible high-performant millimeter-wave multi-chip interconnect. The proposed technique excels with low-loss transmission, small latency and small chip-area consumption. Based on extensive preliminary work done by the applicant, the project is aiming to optimize the overall structures, to implement additional loss-reducing features, and to demonstrate benchmarking performance at a frequency of 180 GHz.

高数据速率片间 /芯片片内通信对于现代计算机系统而言越来越重要。可行的技术允许不存在延迟，低衰减和合理的数据吞吐量的广播 /多铸造传输。该项目旨在开发和探索新的董事会级别芯片芯片互连方案的可能性能。在拟议的项目中探索的技术减轻了有线，无线和光学互连技术的几个缺点。拟议的互连使用介电波导中的低损坏电介质波导，低腔际y峰以及从芯片电路到介电波导的低损失和紧凑型过渡，这会导致可行的高表现高的毫米波动多芯片互连。提出的技术在低损坏的传输，较小的延迟和小型芯片区域消耗方面表现出色。基于申请人进行的广泛初步工作，该项目旨在优化整体结构，实施额外的减少损失功能，并以180 GHz的频率演示基准测试性能。