SHF: Medium: Collaborative Research: Machine Learning Enabled Network-on-Chip Architectures for Optimized Energy, Performance and Reliability
SHF:中:协作研究:支持机器学习的片上网络架构,可优化能源、性能和可靠性
基本信息
- 批准号:1703013
- 负责人:
- 金额:$ 50万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Continuing Grant
- 财政年份:2017
- 资助国家:美国
- 起止时间:2017-06-01 至 2023-09-30
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Network-on-Chip (NoC) architectures have emerged as the prevailing on-chip communication fabric for multicores and Chip Multiprocessors (CMPs). However, as NoC architectures are scaled, they face serious challenges. A key challenge in addressing optimized NoC architecture design today is the plethora of performance enhancing, energy efficient and fault tolerant techniques available to NoC designers and the large design space that must be navigated to simultaneously reduce power, improve reliability, increase performance and maintain QoS. This research proposes a new cross-layer, cross-cutting methodology spanning circuits, architectures, machine learning algorithms, and applications, aimed at designing energy-efficient, reliable and scalable NoCs. This research will result in (1) novel cross-layer design techniques that take a holistic approach of simultaneously reducing power consumption, while still achieving reliability and performance goals for NoCs, (2) a fundamental understanding of the use of hardware-amenable ML for NoC design optimization, (3) software and hardware techniques for monitoring and collecting critical data and key design parameters during network execution to optimize NoC design, and (4) modeling and simulation tools that will improve the architecture community's design methodologies for evaluating scalable NoCs. The proposed research bridges a very important gap between hardware architects who design power management and fault tolerant techniques at the circuit and architecture level and machine learning scientists who develop predictive and optimization techniques. Due to its cross-cutting nature, the proposed research has the potential to significantly transform the design of next-generation CMPs and System-on-Chips (SoCs) where complex decisions have to be made that affect the power, performance and reliability. The research will also play a major role in education by integrating discovery with teaching and training. The PIs are committed and will continue to expand on outreach activities as part of the proposed project by making the necessary efforts to attract and train minority students in this field.
片上网络(NOC)架构已成为用于多学院和芯片多处理器(CMP)的流行片上通信结构。但是,随着NOC架构的扩展,它们面临严重的挑战。当今解决优化的NOC体系结构设计的一个关键挑战是,可供NOC设计师使用的大量增强性能,节能和容忍度的技术以及必须导航的大型设计空间,以同时降低功率,提高可靠性,提高性能,提高性能并保持QoS。这项研究提出了一种跨越电路,体系结构,机器学习算法和应用的新的跨层,横切方法,旨在设计能效,可靠和可扩展的NOC。这项研究将导致(1)新颖的跨层设计技术,这些技术采用同时减少功耗的整体方法,同时仍然实现NOC的可靠性和性能目标,(2)对使用硬件无关的ML用于NOC设计的使用的基本了解,(3)在进行NOC设计,(3)在监视和收集键入的网络设计范围(3)启用了4个型模型(4)以及将改善架构社区设计方法的仿真工具,用于评估可扩展的NOC。拟议的研究弥合了在巡回赛和建筑级别设计电源管理和容忍技术的硬件建筑师之间的一个非常重要的差距,以及开发预测性和优化技术的机器学习科学家。由于其横切性质,拟议的研究有可能显着改变下一代CMP和芯片系统(SOC)的设计,在这些设计中必须做出复杂的决定,以影响力量,性能和可靠性。这项研究还将通过将发现与教学和培训相结合,在教育中发挥重要作用。 PIS是努力的,并将通过在该领域吸引和培训少数族裔学生的必要努力来继续扩大外展活动,作为拟议项目的一部分。
项目成果
期刊论文数量(17)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Parallel Dot Products Using Silicon Photonics
使用硅光子学的并行点积
- DOI:10.1109/ipc48725.2021.9592936
- 发表时间:2021
- 期刊:
- 影响因子:0
- 作者:Wolff, Andy;Shiflett, Kyle;Karanth, Avinash
- 通讯作者:Karanth, Avinash
Bitwise Neural Network Acceleration Using Silicon Photonics
- DOI:10.1145/3453688.3461515
- 发表时间:2021-06
- 期刊:
- 影响因子:0
- 作者:Kyle Shiflett;Avinash Karanth;A. Louri;Razvan C. Bunescu
- 通讯作者:Kyle Shiflett;Avinash Karanth;A. Louri;Razvan C. Bunescu
A High-Performance and Energy-Efficient Photonic Architecture for Multi-DNN Acceleration
- DOI:10.1109/tpds.2023.3327535
- 发表时间:2024-01
- 期刊:
- 影响因子:5.3
- 作者:Yuan Li;A. Louri;Avinash Karanth
- 通讯作者:Yuan Li;A. Louri;Avinash Karanth
Dynamic Voltage and Frequency Scaling in NoCs with Supervised and Reinforcement Learning Techniques
- DOI:10.1109/tc.2018.2875476
- 发表时间:2019-03-01
- 期刊:
- 影响因子:3.7
- 作者:Fettes, Quintin;Clark, Mark;Louri, Ahmed
- 通讯作者:Louri, Ahmed
Hardware-Level Thread Migration to Reduce On-Chip Data Movement Via Reinforcement Learning
通过强化学习进行硬件级线程迁移以减少片上数据移动
- DOI:10.1109/tcad.2020.3012650
- 发表时间:2020
- 期刊:
- 影响因子:2.9
- 作者:Fettes, Quintin;Karanth, Avinash;Bunescu, Razvan;Louri, Ahmed;Shiflett, Kyle
- 通讯作者:Shiflett, Kyle
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Avinash Karanth其他文献
Ultracompact and Low-Power Logic Circuits via Workfunction Engineering
通过功函数工程实现超紧凑和低功耗逻辑电路
- DOI:
10.1109/jxcdc.2019.2962494 - 发表时间:
2019 - 期刊:
- 影响因子:2.4
- 作者:
T. F. Canan;S. Kaya;Avinash Karanth;A. Louri - 通讯作者:
A. Louri
Reconfigurable Gates with Sub-10nm Ambipolar SB-FinFETs for Logic Locking & Obfuscation
具有亚 10nm 双极 SB-FinFET 的可重构栅极,用于逻辑锁定
- DOI:
10.1109/mwscas48704.2020.9184509 - 发表时间:
2020 - 期刊:
- 影响因子:0
- 作者:
T. F. Canan;S. Kaya;H. Chenji;Avinash Karanth - 通讯作者:
Avinash Karanth
Sustainability in Network-on-Chips by Exploring Heterogeneity in Emerging Technologies
通过探索新兴技术的异构性实现片上网络的可持续性
- DOI:
10.1109/tsusc.2018.2861362 - 发表时间:
2019 - 期刊:
- 影响因子:3.9
- 作者:
Avinash Karanth;S. Kaya;A. Sikder;Daniel J. Carbaugh;S. Laha;D. DiTomaso;A. Louri;H. Xin;Junqiang Wu - 通讯作者:
Junqiang Wu
Reflections of Cybersecurity Workshop for K-12 Teachers
K-12 教师网络安全研讨会的思考
- DOI:
10.1145/3545945.3569761 - 发表时间:
2023 - 期刊:
- 影响因子:0
- 作者:
Chad Mourning;H. Chenji;Allyson Hallman;S. Kaya;Nasseef Abukamail;D. Juedes;Avinash Karanth - 通讯作者:
Avinash Karanth
SNAC: Mitigation of Snoop-Based Attacks with Multi-Tier Security in NoC Architectures
SNAC:通过 NoC 架构中的多层安全性缓解基于窥探的攻击
- DOI:
10.1145/3649476.3658769 - 发表时间:
2024 - 期刊:
- 影响因子:0
- 作者:
Siqin Liu;Saumya Chauhan;Avinash Karanth - 通讯作者:
Avinash Karanth
Avinash Karanth的其他文献
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{{ truncateString('Avinash Karanth', 18)}}的其他基金
Collaborative Research: DESC: Type II: Multi-Function Cross-Layer Electro-Optic Fabrics for Reliable and Sustainable Computing Systems
合作研究:DESC:II 型:用于可靠和可持续计算系统的多功能跨层电光织物
- 批准号:
2324645 - 财政年份:2023
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Collaborative Research: SHF: Medium: EPIC: Exploiting Photonic Interconnects for Resilient Data Communication and Acceleration in Energy-Efficient Chiplet-based Architectures
合作研究:SHF:中:EPIC:利用光子互连实现基于节能 Chiplet 的架构中的弹性数据通信和加速
- 批准号:
2311544 - 财政年份:2023
- 资助金额:
$ 50万 - 项目类别:
Continuing Grant
SaTC: CORE: Small: Language Abstractions for Reconfigurable Hardware Monitors on Manycore Architectures
SaTC:CORE:Small:众核架构上可重新配置硬件监视器的语言抽象
- 批准号:
1936794 - 财政年份:2020
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
SHF: Medium: Collaborative Research: Photonic Neural Network Accelerator for Energy-efficient Heterogeneous Multicore Architectures
SHF:中:协作研究:用于节能异构多核架构的光子神经网络加速器
- 批准号:
1901192 - 财政年份:2019
- 资助金额:
$ 50万 - 项目类别:
Continuing Grant
SHF: Medium: Collaborative Research: Scaling On-chip Networks to 1000-core Systems using Heterogeneous Emerging Interconnect Technologies
SHF:中:协作研究:使用异构新兴互连技术将片上网络扩展到 1000 核系统
- 批准号:
1513606 - 财政年份:2015
- 资助金额:
$ 50万 - 项目类别:
Continuing Grant
SHF: Small: Collaborative Research: A Holistic Design Methodology for Fault-Tolerant and Robust Network-on-Chips (NoCs) Architectures
SHF:小型:协作研究:容错和鲁棒片上网络 (NoC) 架构的整体设计方法
- 批准号:
1420718 - 财政年份:2014
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
SHF: Small: Collaborative Research: Power-Efficient and Reliable 3D Stacked Reconfigurable Photonic Network-on-Chips for Scalable Multicore Architectures
SHF:小型:协作研究:用于可扩展多核架构的高效且可靠的 3D 堆叠可重构光子片上网络
- 批准号:
1318981 - 财政年份:2013
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Collaborative Research:EAGER:Exploiting Heterogeneity in Emerging Interconnect Technologies for Building Highly Scalable and Power-Efficient Network-on-Chips for Many-core Systems
合作研究:EAGER:利用新兴互连技术的异构性为多核系统构建高度可扩展且高能效的片上网络
- 批准号:
1342657 - 财政年份:2013
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Power-Efficient Reconfigurable Wireless Network-on-Chip (NoC) Interconnects for Future Many-core Architectures
适用于未来众核架构的高能效可重配置无线片上网络 (NoC) 互连
- 批准号:
1129010 - 财政年份:2011
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
CAREER: Design of Reconfigurable Power and Area-Efficient Nanophotonic Architectures for Future Multi-cores
职业:为未来多核设计可重构功率和面积高效的纳米光子架构
- 批准号:
1054339 - 财政年份:2011
- 资助金额:
$ 50万 - 项目类别:
Continuing Grant
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合作研究:SHF:媒介:可微分硬件合成
- 批准号:
2403134 - 财政年份:2024
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合作研究:SHF:中:用于大人工智能的微型芯片:可重新配置的封装系统
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合作研究:SHF:中:通过轻量级仿真方法实现大规模工作负载的 GPU 性能仿真
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2402806 - 财政年份:2024
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