GOALI: Dynamic Adhesive Failure of Patterned Thin Films

目标：图案化薄膜的动态粘合失效

• 批准号: 0726742
• 负责人: Nancy Sottos
• 金额: $ 30万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2011-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0726742&HistoricalAwards=false
• 关键词: GOALI; Dynamic; Adhesive; Failure; Patterned

This collaborative project seeks to address a longstanding problem in multilayer thin film devices adhesive failure and attendant delamination. The research will lead to the development of new experimental and computational tools for studying the adhesive failure in multilayer thin film devices critical to microelectronic packaging. Specifically, the complex relationships between surface properties, process-induced residual stress, and loading rate will be investigated to achieve a more fundamental understanding of interfacial failure. Experimental efforts focus on creating a protocol to generate controlled interfacial delamination using the inertial effects associated with laser generated stress waves. This elegant, non-contacting loading technique provides a robust method for characterizing interfacial failure. The experiments are supported by the development of a combined spectral/finite element scheme to extract the interfacial fracture energy and evaluate the evolution of interface tractions and the components of energy flowing into the crack-tip. The testing and analysis protocols developed under this GOALI program will be transitioned for use by the microelectronics industry. The project will support the education and training of graduate and undergraduate students at the University of Illinois. These students will be part of an interdisciplinary research group at the Beckman Institute for Advanced Science and Technology that will foster critical interactions with other students and faculty through group meetings, seminars and co-located lab facilities.

该协作项目旨在解决多层薄膜设备粘合失败和随之而来的分层的长期问题。这项研究将导致开发新的实验和计算工具，以研究对微电包装至关重要的多层薄膜设备的粘合剂故障。具体而言，将研究表面特性，过程诱导的残余应力和负载率之间的复杂关系，以实现对界面故障的更基本的理解。实验努力的重点是创建与激光产生的应力波相关的惯性效应生成受控的界面分层的方案。这种优雅的非接触式载荷技术为表征界面故障提供了强大的方法。实验得到了组合光谱/有限元方案的发展，以提取界面断裂能，并评估界面牵引界的演变以及流入裂纹尖端的能量的成分。在此目标计划下开发的测试和分析协议将通过微电子行业过渡。该项目将支持伊利诺伊大学的研究生和本科生的教育和培训。 这些学生将成为贝克曼高级科学技术研究所跨学科研究小组的一部分，该研究所将通过小组会议，研讨会和共同确定的实验室设施来促进与其他学生和教职员工的关键互动。