Thin Film Fracture and Decohesion in Micro- and Nano-Patterned Devices

微米和纳米图案器件中的薄膜断裂和剥离

• 批准号: 0408487
• 负责人: Nancy Sottos
• 金额: --
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-06-01 至 2008-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0408487&HistoricalAwards=false
• 关键词: Thin; Film; Fracture; Decohesion; Micro

Proposal ID: 0408487PI: Sottos, NancyOrganization: University of Illinois at Urbana-ChampaignTitle: Thin film fracture and decohesion in micro- and nano-patterned devicesThis research focuses on the unique fracture and decohesion problems associated with micro-and nano-patterned thin film devices fabricated via soft lithographic methods. Soft lithography encompasses a group of techniques, such as microcontact printing (m-CP) and nanotransfer printing (n-TP) that use a flexible elastomeric stamp to form patterns of self-assembled monolayers (SAMs) on the surfaces of substrates. The SAMs can then serve as resists for selective etching or templates for selective deposition to form the final thin film device. These additive methods of patterning are used to create complex 2-D and 3-D structures with feature sizes ranging from hundreds of microns to tens of nanometers for a broad set of applications in electronics, sensors and MEMS. A collaborative experimental and computational approach is proposed to investigate the relationships between surface chemistry, interfacial fracture energy, processing induced residual stress, and cracking in patterned thin films.Intellectual Merit: The research described in this proposal will result in several new experimental and computational tools to quantify the interfacial fracture energy in ultra-thin, patterned films that are difficult to characterize by conventional adhesion tests. Thin film adhesive strength will be characterized under a full range of mixed-mode dynamic loading conditions using a laser induced pulsed loading technique. Laser pulse absorption generates high amplitude, short duration stress wave pulses to load the interface between a film and a substrate. A dynamic edge delamination test will be developed to obtain the initiation and propagation fracture toughness of the interface. The link to meaningful fracture parameters is achieved with the aid of appropriate analytical and numerical tools to support the experiments. Powerful numerical schemes that combine spectral methods with cohesive volumetric finite methods will be developed to accurately extract interfacial fracture toughness. The experimental and computational tools developed under the current research will provide a quantitative understanding of patterned film fracture that can guide the design and development of new inks, transfer chemistries, and stamps for the next generation of devices fabricated by soft lithography.Broader Impact: This project integrates research activities involving thin film processing, experimental mechanics and numerical fracture analysis, providing an excellent setting for the education and training of two graduate students at the University of Illinois. Moreover, these students will be part of an interdisciplinary research group at the Beckman Institute for Advanced Science and Technology that will facilitate broader interactions with other students and faculty from Chemistry, Chemical Engineering, and Materials Science. An additional REU supplement will be requested to support two undergraduate researchers to work on both experimental and computational aspects of the project. Efforts will be made to recruit graduate students from underrepresented groups for these positions. The PIs participate in a number of outreach activities to increase the pool, recruit and retain underrepresented students at the undergraduate and graduate levels.

提案ID：0408487PI：Sottos，Nancyoranization：伊利诺伊大学在Urbana-Champaigntitle上：微型和纳米形式的Devicesthis研究中的薄膜骨折和脱落，重点介绍与独特的骨折和与微型薄膜相关的薄膜薄膜胶片设备的重点通过柔软的光刻方法制造。软光刻涵盖了一组技术，例如微接合印刷（M-CP）和纳米转移打印（N-TP），它们使用柔性弹性邮票在底物表面上形成自组装单层（SAM）的模式。然后，SAM可以用作选择性蚀刻或模板的选择性沉积以形成最终薄膜设备的模板。这些构图的添加方法用于创建复杂的2-D和3-D结构，其特征大小从数百微米到数十纳米的特征大小，用于电子，传感器和MEMS中的广泛应用。提出了一种协作实验和计算方法，以研究表面化学，界面断裂能，加工诱导的残余压力以及在图案化薄膜中破裂之间的关系。智能优点：本提案中描述的研究将导致几种新的实验和计算工具为了量化超薄的图案膜中的界面断裂能，这些膜很难通过常规粘附测试来表征。使用激光诱导的脉冲载荷技术，将在全范围的混合模式动态载荷条件下表征薄膜粘合强度。激光脉冲吸收会产生较高的振幅，持续时间短应力波脉冲，以加载膜和底物之间的界面。将开发动态边缘分层测试，以获得界面的启动和传播裂缝韧性。借助适当的分析和数值工具来支持实验，可以实现与有意义的断裂参数的链接。将开发将光谱方法与粘性体积有限方法相结合的强大数值方案，以精确提取界面裂缝韧性。在当前研究中开发的实验和计算工具将对图案膜断裂提供定量的理解，可以指导新墨水的设计和开发，转移化学和邮票，用于由软光刻制造的下一代设备。项目整合了涉及薄膜处理，实验力学和数值断裂分析的研究活动，为伊利诺伊大学的两名研究生的教育和培训提供了一个绝佳的环境。此外，这些学生将成为贝克曼高级科学技术研究所的跨学科研究小组的一部分，该研究所将促进与化学，化学工程和材料科学的其他学生和教职员工进行更广泛的互动。将要求另一项REU补充剂支持两名本科研究人员，以研究项目的实验和计算方面。将努力从代表性不足的团体中招募这些职位的研究生。 PI参加了许多外展活动，以增加泳池，招募并保留本科和研究生级别的人数不足的学生。