SST: Integrated Manufacturing for Millimeterwave Sensing Systems

SST：毫米波传感系统集成制造

• 批准号: 0428884
• 负责人: Liwei Lin
• 金额: $ 75万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-09-01 至 2008-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0428884&HistoricalAwards=false
• 关键词: SST; Integrated; Manufacturing; Millimeterwave; Sensing

The research goal of this Sensor Small Team (SST) award is to investigate integrated manufacturing processes for miniaturized millimeter wave systems. The team members are to jointly work on innovative processes toward low-cost, batch-fabricated, miniaturized and integrated millimeter wave systems for sensing, imaging and communication applications. The system front-end is based on the electronically-controlled millimeter wave beam-former architectures with new manufacturing approaches utilizing micromachining techniques to fabricate three-dimensional radio-frequency structures including antennas, splitters, phase shifters, waveguides and passive components in a batch fashion. The overall system architecture consists of three flip-chip bonded physical layers: antenna, transmission-line and circuit layers. The antenna layer serves as a vertical integration platform that has a horn antenna array with high gain and coupling efficiency. Several enabling plastic micro-manufacturing process modules are to be established, including plastic molding, embossing, mechanical polishing, assembly and bonding processes. The low-cost high-power millimeter wave front-ends will create a wide range of novel sensing applications such as vision goggles that assist firefighters to see through smoke, mobile radars that enhance safety in foggy weather for automobiles and airplanes, chemical and biological agent detection by spectrometry and portable broadband communication systems. The new micro manufacturing processes will benefit the general Microelectromechanical Systems community to inspire new device development. The synergy of research interaction and integration between manufacturing (mechanical engineering) and high frequency devices (electrical engineering) will be an engine for the multidisciplinary fusion in research expertise for the next-generation scientists and engineers.

该传感器小型团队（SST）奖的研究目标是调查针对微型毫米波系统的综合制造过程。 团队成员将共同开展创新的过程，用于低成本，批量制造，微型和集成的毫米波系统，以进行感应，成像和通信应用。 系统前端基于电子控制的毫米波梁形成型结构，采用新制造方法利用微加工技术来制造三维射频播放结构，包括天线，分裂器，相位变速器，相位变速器，波形，波导，波导和无源成分，以批量方式进行。 整个系统架构由三个翻转芯片键合的物理层组成：天线，传输线和电路层。 天线层是一个垂直积分平台，具有具有高增益和耦合效率的号角天线阵列。 将建立几个启用塑料微型制造工艺模块，包括塑料成型，压花，机械抛光，组装和粘结过程。低成本的高动力毫米波的前端将创建广泛的新型感应应用，例如视觉护目镜，可以帮助消防员通过烟雾，移动雷达，可通过光谱法和便携式扩展通信系统来提高汽车和飞机的雾气安全性，从而提高雾气的安全性。 新的微型制造工艺将使一般的微机电系统社区受益，以激发新的设备开发。 研究互动的协同作用以及制造业（机械工程）和高频设备（电气工程）之间的整合将是下一代科学家和工程师研究专业知识中多学科融合的引擎。