Resistance monitoring of novel solders during processing and operation at high temperatures

高温加工和操作期间新型焊料的电阻监测

• 批准号: 486412-2015
• 负责人: Mayer, Michael
• 金额: $ 1.81万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=585584
• 关键词: Resistance; monitoring; novel; solders; during

Solders are ubiquitous in electronic products and methods to improve the performance and lower the cost of lead-free solders are needed in many industries (electronics, automotive, medical, aerospace, etc.). Alloying elements to existing lead-free solders is a way to alter solder performance. Many elements can be added to existing solder alloys and the number of possible alloying combinations is so large that finding the best combination is impossible with conventional means. The development of an in situ measurement method for solder resistance is proposed to accelerate the assessment of novel solder alloys leading to a larger number of alloying combinations to be tested for a given time. This will increase the chances of finding new solders with improved performance. The proposed project will develop an automated characterization setup for the new method to increase the number of solder samples that can be assessed. In contrast to conventional methods of reliability analysis which involve the cross-sectioning of samples, the new method will be employed during reflow and during reliability testing, leading to improved data and a better understanding of the failure mechanisms of joints made with novel solder alloys, and ultimately helping the quest for improved solder joints of the future.

在许多行业（电子，汽车，医疗，航空航天等）中，焊料在电子产品和改善性能并降低无铅焊料成本的方法中无处不在。与现有无铅焊料的合金元素是改变焊料性能的一种方式。许多元素可以添加到现有的焊料合金中，并且可能的合金组合的数量如此之大，以至于不可能通过传统手段找到最佳组合。 提出，提出了一种原位测量方法来加速对新型焊料合金的评估，从而在给定时间内测试了大量合金组合。这将增加发现新焊料具有提高性能的机会。拟议的项目将为新方法开发自动表征设置，以增加可以评估的焊料样品数量。与涉及样品横截面的常规可靠性分析方法相反，在回流期间和可​​靠性测试期间将采用新方法，从而改善了数据，并更好地了解与新型焊料合金制造的关节的失败机制，并最终帮助改善了未来未来的焊接焊点。