Development of novel palladium coated bonding wire for microelectronics

微电子用新型镀钯键合线的研制

• 批准号: 439273-2012
• 负责人: Mayer, Michael
• 金额: $ 0.84万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2014
• 资助国家: 加拿大
• 起止时间: 2014-01-01 至 2015-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=553408
• 关键词: Development; novel; palladium; coated; bonding

Fine wire bonds are used primarily to form electrical connections to semiconductor devices such as microcircuits or light emitting diodes. Gold (Au) is the most commonly used wire material for such bonds due to its favorable properties. Copper (Cu) wire is a lower cost, more conductive alternative. However, Cu wire is harder and oxidizes during bonding which leads to the semiconductor being destroyed in many applications.

细线键主要用于与半导体设备（例如微电路或发光二极管）形成电气连接。由于其有利的性质，黄金（AU）是此类键的最常用的电线材料。铜（CU）电线是较低的成本，更具导电性的替代方案。但是，铜线更难，在键合过程中氧化，这会导致在许多应用中被半导体破坏。