Non-destructive testing method for inspecting the quality of plated parts and soldered joints

检验镀件和焊点质量的无损检测方法

基本信息

批准号：
103737
负责人：
金额：
$ 1.9万
依托单位：
SEMELAB LIMITED
依托单位国家：
英国
项目类别：
Collaborative R&D
财政年份：
2017
资助国家：
英国
起止时间：
2017 至无数据
项目状态：
已结题

来源：
https://gtr.ukri.org/projects?ref=103737
关键词：
Non destructive testing method inspecting

项目摘要

This proposal aims to develop a method of evaluating the quality of plated pieceparts and soldered joints using a technique which addresses the “non-destructive inspection technologies and engineering measurements” example under the competition brief. The products that are manufactured at Semelab all contain soldered joints to bond materials together, typically materials that are plated. The quality of the plating of the incoming pieceparts is evaluated using a destructive bend test and solderability test that are performed on a sample basis but does not guarantee to highlight all potential faults in the plating. For example recently a plated pin from a supplier was found to have 5% defective parts within the lot that was not exposed during incoming destructive sample testing, processed through the assembly line and identified during 100% screening tests, leading to a significant delay to the customer. The approach taken will be to explore current techniques with NPL, for example Lock-in Thermography, Time Domain Reflectroscopy (TDR) and electrical noise measurements to evaluate whether these techniques are capable of detecting defective plated pieceparts and soldered joints.The success of this project would revolutionise the electronics manufacturing process as currently there is no known non-destructive technique of evaluating soldered joints directly after the manufacturing process which would lead to higher quality levels of product and less potential for suspect modules to be delivered to customers.

该提案旨在开发一种评估电镀零件和焊接接头质量的方法，该方法采用了竞赛简介中“无损检测技术和工程测量”示例的技术。Semelab 生产的产品均包含焊接接头。将材料粘合在一起，通常是电镀的材料，传入零件的电镀质量使用破坏性弯曲测试和可焊性测试，这些测试是在样品的基础上进行的，但不能保证突出显示零件中的所有潜在缺陷。例如，最近发现供应商的电镀引脚有 5% 的缺陷零件，这些零件在传入的破坏性样品测试期间未暴露出来，并通过装配线进行处理，并在 100% 筛选测试期间进行了识别，从而导致了严重的延误。采取的方法将是探索 NPL 的现有技术，例如锁定热成像、时域反射镜 (TDR) 和电噪声测量，以评估这些技术是否能够检测有缺陷的电镀零件和焊接零件。该项目的成功将彻底改变电子制造过程，因为目前还没有已知的无损技术可以在制造过程后直接评估焊点，这将提高产品质量水平并减少交付可疑模块的可能性给客户。