In-situ TEM observation of silicon fatigue process using resonance compressive fatigue test

利用共振压缩疲劳试验对硅疲劳过程进行原位 TEM 观察

• 批准号: 23360054
• 负责人: KAMIYA Shoji
• 金额: $ 11.9万
• 依托单位: Nagoya Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011-04-01 至 2014-03-31
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23360054/
• 关键词: シリコン; MEMS; 疲労試験; 圧縮応力; TEM; その場観察; 透過型電子顕微鏡; EBIC; 再結合欠陥; 透過電子顕微鏡; 共振デバイス

The purpose of this study is to observe directly silicon fatigue process from initial defect to fatigue fracture by in-situ TEM fatigue test for surveying the fatigue mechanism. Compressive-tensile test device with comb drive actuator was fabricated using SOI-MEMS technologies. TEG (test element group) device was electrically actuated by applying voltage under vacuum environment. For fatigue test with controlled stress ratio, TEM holder was developed by assembling a load cell, piezo actuator, and electrostatic probe. Under cyclic compressive load, accumulation of recombination defect was observed using electron beam induced current imaging. It was found that this defect was deeply related with decrease in fracture strength of silicon.

本研究的目的是通过原位TEM疲劳试验直接观察硅从初始缺陷到疲劳断裂的疲劳过程，以探讨疲劳机理。采用 SOI-MEMS 技术制造了带有梳状驱动执行器的压缩拉伸测试装置。 TEG（测试元件组）装置通过在真空环境下施加电压来电驱动。为了进行受控应力比的疲劳测试，通过组装称重传感器、压电执行器和静电探针开发了 TEM 支架。在循环压缩载荷下，使用电子束感应电流成像观察复合缺陷的积累。研究发现，这种缺陷与硅断裂强度的降低密切相关。

项目成果

Direct observation of damage accumulation process inside silicon under mechanical fatigue loading

机械疲劳载荷下硅内部损伤累积过程的直接观察

• 发表时间: 2013
• 作者: S. Kamiya;R. Hirai;H. Izumi;N. Umehara;T. Tokoroyama
• 通讯作者: T. Tokoroyama

Statistical Characterization of Fracture Strength and Fatigue Lifetime of Polysilicon Thin Films with Different Stress Concentration Fields

• DOI: 10.1299/jmmp.6.1013
• 发表时间: 2012
• 期刊: Journal of Solid Mechanics and Materials Engineering
• 作者: V. Huy;S. Kamiya;J. Gaspar;O. Paul

異なる疲労機構に基づくシリコン微小構造物の寿命評価モデルの比較

基于不同疲劳机制的硅微结构寿命评估模型比较

• 发表时间: 2012
• 作者: 平川創;泉隼人;生津資大;神谷庄司
• 通讯作者: 神谷庄司

Mysteries in fracture behavior of silicon and polysilicon micro-scale structures in various environments and under repeated loading

硅和多晶硅微尺度结构在各种环境和重复载荷下断裂行为的奥秘

• 发表时间: 2012
• 作者: 丹 愛彦;青木 尊之;井上 景介;吉谷清;西山諒,久保司郎,井岡誠司;S.Kamiya
• 通讯作者: S.Kamiya

A prediction scheme of the static fracture strength of MEMS structures based on the characterization of damage distribution on a processed surface

• DOI: 10.1088/0960-1317/23/4/045008
• 发表时间: 2013-04
• 期刊: Journal of Micromechanics and Microengineering
• 影响因子: 2.3
• 作者: V. Huy;S. Kamiya;K. Nagayoshi;H. Izumi;J. Gaspar;O. Paul