Establishment of a new method of evaluation for the adhesive strength of thin films by micro-indentation wit two degrees of freedom

二自由度微压痕评价薄膜粘合强度新方法的建立

基本信息

批准号：
10555024
负责人：
KAMIYA Shoji
金额：
$ 3.71万
依托单位：
TOHOKU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
1998
资助国家：
日本
起止时间：
1998 至 1999
项目状态：
已结题

项目摘要

This research project aims at the establishment of a new method of evaluation for the adhesive strength of thin films by micro-indentation with two degrees of freedom. We studied the following three points and have succeeded to developed a method which can be generally applicable to various combinations of films and substrates.Trial production of two-freedom indentorA micro-indentation set-up with two degrees of freedom was developed. This is equipped with an optical microscope which enables real-time observation of crack extension behavior for the measurement of interface crack length.Selection of the optimum loading path and shape of indentorVarious loading, configurations were examined by using the indentor developed above. As a conclusion, specimens should be prepared where the film is projected a little out of the cross section of the substrate. This projection is pushed upwards from the interface side by a conical stylus of diamond, which we found the best way to efficiently extend an interface crack.Evaluation of toughness by the computational simulationComputational simulations were carried out according to the loading configuration above. By comparing the crack extension resistance curves obtained by both experiment and simulation, we succeeded to evaluate the toughness of interface. As an example, the toughness of interface between a WC-Co substrate and the diamond film prepared as a wear protection coating was determined to be about 14 J/mィイD12ィエD1. Although adhesion of wear protection coating is one of the critical problems, this is the first quantitative data ever obtained all over the world for the adhesive strength of diamond coatings on WC-Co cutting tools. This fact proves that our new method is quite a successful one with a significant advantage for industries.

该研究项目的目的是建立一种新的评估方法，以通过微观定位和两个自由度来建立薄膜的粘合力强度。我们研究了以下三个点，并成功地开发了一种通常适用于膜和底物的各种组合的方法。开发了两种自由度的两种自由度的微型识别设置的试验。这与光学显微镜相同，该光学显微镜可以实时观察裂纹延伸行为，以测量界面裂纹长度。选择最佳加载路径和凹陷载荷的形状，使用上面开发的固件检查配置。总而言之，应该准备标本，如果膜从基板的横截面稍微伸出一点。该投影通过钻石的圆锥形手写笔向上推动，我们发现这是有效扩展接口裂纹的最佳方法。根据上面的加载配置进行了计算模拟计算的韧性评估韧性。通过比较通过实验和模拟获得的裂纹延伸电阻曲线，我们成功地评估了界面的韧性。例如，WC-CO底物与作为磨损保护涂层制备的钻石膜之间界面的韧性被确定为约14 J/my D12 D1。尽管磨损保护涂层的广告是关键问题之一，但这是世界各地获得的第一个定量数据，用于WC-CO切割工具上钻石涂料的粘合力。这一事实证明，我们的新方法对行业具有重要优势是一种成功的方法。