Establishment of a new method of evaluation for the adhesive strength of thin films by micro-indentation wit two degrees of freedom

二自由度微压痕评价薄膜粘合强度新方法的建立

基本信息

批准号：
10555024
负责人：
KAMIYA Shoji
金额：
$ 3.71万
依托单位：
TOHOKU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
1998
资助国家：
日本
起止时间：
1998 至 1999
项目状态：
已结题

项目摘要

This research project aims at the establishment of a new method of evaluation for the adhesive strength of thin films by micro-indentation with two degrees of freedom. We studied the following three points and have succeeded to developed a method which can be generally applicable to various combinations of films and substrates.Trial production of two-freedom indentorA micro-indentation set-up with two degrees of freedom was developed. This is equipped with an optical microscope which enables real-time observation of crack extension behavior for the measurement of interface crack length.Selection of the optimum loading path and shape of indentorVarious loading, configurations were examined by using the indentor developed above. As a conclusion, specimens should be prepared where the film is projected a little out of the cross section of the substrate. This projection is pushed upwards from the interface side by a conical stylus of diamond, which we found the best way to efficiently extend an interface crack.Evaluation of toughness by the computational simulationComputational simulations were carried out according to the loading configuration above. By comparing the crack extension resistance curves obtained by both experiment and simulation, we succeeded to evaluate the toughness of interface. As an example, the toughness of interface between a WC-Co substrate and the diamond film prepared as a wear protection coating was determined to be about 14 J/mィイD12ィエD1. Although adhesion of wear protection coating is one of the critical problems, this is the first quantitative data ever obtained all over the world for the adhesive strength of diamond coatings on WC-Co cutting tools. This fact proves that our new method is quite a successful one with a significant advantage for industries.

本研究项目旨在建立一种通过二自由度微压痕评估薄膜粘合强度的新方法，我们研究了以下三点，并成功开发了一种可普遍适用于各种情况的方法。薄膜和基材的组合。二自由度压头的试制开发了一种具有二自由度的微压痕装置，该装置配备了光学显微镜，可以实时观察裂纹扩展行为，以测量界面裂纹。长度的选择压头的最佳加载路径和形状通过使用上面开发的压头检查了各种加载和配置，得出的结论是，应在薄膜稍微突出基材横截面的位置制备样品。该突出部分从基材向上推。通过金刚石锥形触针在界面侧进行测量，我们找到了有效扩展界面裂纹的最佳方法。通过计算模拟评估韧性根据上述加载配置进行了计算模拟，通过比较裂纹扩展阻力。通过实验和模拟获得的曲线，我们成功地评估了界面的韧性作为一个例子，WC-Co基体和作为磨损保护涂层制备的金刚石膜之间的界面韧性被确定为约14 J/m。 D12 D1。虽然磨损保护涂层的附着力是关键问题之一，但这是世界范围内首次获得关于WC-Co切削刀具上的金刚石涂层附着力的定量数据。这一事实证明了我们的新方法是正确的。这是一个非常成功的项目，对行业具有显着的优势。