Study on High Efficiency Sliceing for Hard and Brittle Materials

硬脆材料高效切片研究

基本信息

批准号：
63550111
负责人：
ISHIKAWA Ken-ichi
金额：
$ 1.15万
依托单位：
KANAZAWA INSTITUTE OF TECHNOLOGY
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1988
资助国家：
日本
起止时间：
1988 至 1989
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-63550111/
关键词：
Abrasive Grains Diamond Grains Vibration Multiwire Sawing Hard and Brittle Material High Efficiency High Accuracy ラッピング加工マルチワイヤソー加工クラック層

项目摘要

We studied on high efficiency sliceing for hard and brittle materials in two years. As the results, the following becomes clear.1. In the vibration sliceing, when frequency of the wire << natural frequency of the wire, movement of the wire becomes linear.2. The machining efficiency in the vibration slicing is an increase of 2 times compared with the non- vibration slicing by entrance of effective abrasive grains and an increase of effective slicing load.3. The interdependence between machining efficiency in the vibration slicing and phase angle of vibrations of both sides in processing part is little.4. Thickness of wafers after slicing shows such a tendency that the thickness in the vibration slicing is little more thin than the thickness in the nonvibration slicing. And, depression of the thickness decreases as the vibration amplitude increases.5. Waviness of wafers after slicing shows tendency that waviness in the longitudinal direction increases slightly as the amplitude increases and the waviness in the slicing direction decreases as the amplitude increases.6. Processing crack layer of silicone wafer in the vibration slicing shows the same value ( 6-9 mum) as it in the nonvibration slicing.7. The apparatus to grind spiral grooves on surface of wire tool is designed and made as an experiment, and tensile stress of the spiral grooved wire tool is measured. As the results, tensile stress of the spiral grooved wire shows a decrease from 80 % to 90 % compared with the ordinary wire.8. When the spiral grooved wire is used, the machining efficiency increases as pitch of the spiral grooves decreases. And when pitch of the spiral grooves is 2 am, the machining efficiency in the vibration slicing is a increase of 4 times compared with the ordinary wire used in the nonvibration slicing.

我们在两年内研究了硬质和脆性材料的高效率切片。随着结果，以下内容变得清晰。1。在振动切片中，当导线的频率<<电线的固有频率时，电线的运动变成线性2。振动切片的加工效率是通过有效磨料晶粒的入口和有效切片载荷增加的非振动切片的增加2倍。3。加工部分中双方振动的振动切片中的加工效率之间的相互依赖性很小。4。切片后的晶圆厚度表明趋势是，振动切片中的厚度比不振动切片的厚度薄。并且厚度的抑郁随振动振幅的增加而减小。5。切片后晶圆的波状表明，随着幅度的增加，切片方向的波动略微增加，切片方向的波动略有增加，随着幅度的增加而降低。6。振动切片中有机硅晶片的处理裂纹层显示出与未振动切片中相同的值（6-9 MUM）。7。设计并制作了螺旋式螺旋凹槽的设备作为实验，并测量了螺旋凹槽工具的拉伸应力。结果，与普通电线相比，螺旋槽线的拉伸应力从80％下降到90％。8。当使用螺旋凹槽的线时，随着螺旋凹槽的螺距减小，加工效率会提高。当螺旋凹槽的音高为2点时，与未振动切片中使用的普通电线相比，振动切片的加工效率增加了4倍。