High Speed Slicing by Thin Diamond Wire Tool

使用细金刚石线工具进行高速切片

基本信息

批准号：
13650139
负责人：
SUWABE Hitoshi
金额：
$ 2.24万
依托单位：
Kanazawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2003
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650139/
关键词：
Slicing Wire Tool Diamond Grains Thin Wire Tool Hard and Brittle Materials 研削切断半導体材料

项目摘要

As the results until last year, the plating apparatus to make thin diamond wire tool under φ180μm and the slicer to run the wire tool at high speed were manufactured for experiment of this research project. And, the relation between twist pitch of the thin wire tool and the processing characteristics were clear. In this year, the processing mechanisms of thin wire tool are examined through the material intensity test and the slicing test of thin wire tool. And, the followings are clear.1.As the results to examine the best plating conditions to thin wire tool from point of the plating time, the plating pool length, the current density, the pre-plating pool length to improve stick strength between diamond grains and core wire is 200mm, the plating pool length to fix the diamond grains is 200mm, the after-plating pool length to make uniform extrusion amount is 200mm, and the current density is 1.5〜2.0×10^3 A/m^2.2.As the results of the intensity test of thin wire tool, the tensile strength of wire tool decreases to the normal diamond wire tool by effect of decrease of the cross section. And, the twist strength of thin wire tool shows the value of 1.5 times to the normal wire tool.3.As the examinations of effect between twist pitch of thin wire tool and slicing characteristics, the slicing efficiency shows the best value at 8mm of twist pitch. It is clear that the many diamond grains act on the processing surface in case of thin wire tool of long pitch.4.As the results of measurement for processing surface, the accuracy of processing surface by the thin wire tool shows same value with the accuracy by the normal wire tool.

作为直到去年的结果，在φ180μm下制造薄钻石电线工具和切片机以高速运行电线工具的镀金设备是为该研究项目的实验制造的。而且，薄导线工具的扭曲音高与处理特性之间的关系是明确的。在今年，通过材料强度测试和薄导线工具的切片测试检查了薄导线工具的加工机制。 1.结果，从电镀时间，电镀池长度，电流密度，电流密度，预铺平台的长度来检查薄电线工具的最佳镀层条件以提高钻石谷物和芯线之间的粘量强度为200mm，固定钻石晶粒的长度为200mm，是200mm的长度，将当前的量度为200mm和200mm，是200mm，以及当前的10mm， a/m^2.2.在薄导线工具的强度测试的结果时，线工具的拉伸强度通过横截面的减小而降低了正常的钻石线工具。而且，薄导线工具的扭曲强度显示了正常线工具的1.5倍。3。在薄导线工具的扭曲螺距和切片特性之间的效果检查时，切片效率显示出8mm的扭转螺距的最佳值。显然，在长距离薄的钢丝工具的情况下，许多钻石晶粒作用于加工表面。4。在处理表面的测量结果中，薄导线工具的加工表面的准确性与普通线工具的准确性相同。