Development of ID-blade saw using elliptical vibration

开发利用椭圆振动的内径锯

基本信息

批准号：
12650128
负责人：
ISHIKAWA Ken-ichi
金额：
$ 2.18万
依托单位：
Kanazawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-12650128/
关键词：
Grinding Slicing Cutting ID-blade saw Chipping Semiconductor material Hard and brittle material ダイヤモンド砥粒振動加工

项目摘要

The ID-blade saw is one of slicing method to semiconductor materials and hard and brittle materials. The investigator designed to develop the new slicing system of ID-blade saw and studied on slicing characteristics and processing mechanisms by using the working fluid with SiC grains. As the results, the followihgs are clear;1. The slicing was practiced to mix the SiC grains in the water like working fluid. As the experimental results, The exclusive working fluid for multi-wire saw that add the prevention of evaporation and settlement showed better slicing characteristics than water or normal cutting oil.2. The SiC grains were good for mixed abrasive grains in the working fluid because these grains have high breaking characteristic. When the diameter of the SiC grains was same to mean projection length of diamond grains on the tool, the edge chipping showed smallest value.3. The length of edge chipping changed to depend on cut-in and cut-out angles between tool and workpiece. The chipping length at the cut-in side was smaller than one at the cut-out side. When cut-in and the cut-out angles became small, the length of edge chipping showed small value. And, it was clear that the length of chipping by vibration processing became larger than non-vibration cutting.4. The waviness and BOW of wafers became small by the working fluid with SiC grains. And, the surface roughness of wafers became large. The damage layer on wafer surface was 30μm.5. The wear volume of tool became large by the working fluid with SiC grains.

ID刀片锯是半导体材料和硬质和脆性材料的切片方法之一。旨在通过使用与SIC晶粒的工作流体来开发新的ID刀片锯和研究的新切片系统的研究者。结果，结果很清楚； 1。练习切片以将水在水中的SIC颗粒（如工作流体）混合。作为实验结果，多线的独家工作流体增加了预防经济性和设置比水或正常切割油显示出更好的切片特性。2。 SIC晶粒对工作流体中的混合磨粒晶粒非常有用，因为这些谷物具有很高的特征。当SiC晶粒的直径相同以表示工具上钻石晶粒的投影长度时，边缘碎屑显示最小的值。3。边缘碎屑的长度变为取决于工具和工件之间的切入和切开角度。切入侧的碎屑长度小于切口侧的碎屑长度。当切入和切口角变得很小时，边缘碎屑的长度显示出很小的值。而且，很明显，通过振动处理的碎裂长度变得大于未振动切割4。波浪和弓的波浪和弓形的液体与SIC晶粒的工作流体变得很小。而且，海浪的表面粗糙度变得很大。摇摆表面的损伤层为30μm。5。用SIC谷物的工作液变大工具变大。