Development of Thin Film Radiation Detectors using TiO_2 film by plasma CVD method
等离子体CVD法研制TiO_2薄膜辐射探测器
基本信息
- 批准号:15560267
- 负责人:
- 金额:$ 2.37万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (C)
- 财政年份:2003
- 资助国家:日本
- 起止时间:2003 至 2004
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The TiO_2 film have been deposited on alumina substrate by the 50Hz plasma-enhanced CVD at 600℃ using TiCl_4+O_2 gas mixture with a substrate bias circuit using two diodes. Substrate bias voltage was -50(V), and the gas mixture ratio (TiO_2/O_2) was 0.05. The refractive index, dielectric constant and optical energy gap were about 2.7, 120 and 3.0, respectively.Thin film Radiation detector was made by TiO_2/alumina structure. TiO_2 on alumina plate (1mm in thickness) was deposited 100(nm) to 1(μm) in thickness by the plasma CVD. It seems that thickness of TiO_2 influence upon detector S/N characters. Detector dark current at TiO_2 thickness 200(nm) of TiO_2/alumina structure by 10(V) applied voltage was few tens pA, 1(μm) thickness TiO_2/alumina was few nA current. Therefore, I think so that the thickness of TiO_2 is better than less about 100(nm). Gold thin film two electrodes were set on TiO_2/alumina structure, and add 1 to 100(V) between two electrodes. The film detector was irradiated γ-ray and X-ray of exposure rate 2〜8(C/kg/min) and 5〜33×10^<-4>(C/kg/min), respectively. Irradiation current of I=5 (pA) to 300(pA) was measured with an electrometer at applied voltage 10(V). The measured irradiation current has linearity against radiation intensity. And detection sensitivity of radiation was about 60(nA/ (C/kg/min)). Accordingly, it appears that the thin film radiation detector of TiO_2/alumina structure can be measuring intensity of γ-ray and X-ray. Moreover, the detector was made possible small size as 5×5×1(mm). Moreover, SiC/alumina structure has lower dark current than that of TiO_2/alumina structure. Therefore, it seems that SiC/alumina structure was good detector in comparison with TiO_2/alumina structure.
使用两个二极管使用TICL_4+O_2 RCUIT,在600°C下使用50Hz等离子体的CVD BEAD膜折射率,介电偏间间隙约为2.7、120和3.0 CTOR,通过Tio_2/氧化铝结构在氧化铝板上(在此TILKNESS 1mm)上进行TIO_2。检测器S/N字符膜在TiO_2/氧化铝结构上设置了两个电极,膜检测器被照射γ射线,暴露速率2-8(CG/min)5-33×10^<-4>(C/kg/min) ,在施加电压10(v)辐射电流的辐射强度的辐射电流时,用电源计测量了I = 5(PA)至300(PA)的辐射电流,对辐射强度有线性。看起来,薄膜辐射检测器的Tio_2/氧化铝结构可以保持γ射线和射线的强度。与TIO_2/氧化铝结构相比,是良好的检测器。
项目成果
期刊论文数量(44)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Date H: "Development of RISA Detectors for Onsite Sensing and Microdocimetry"International Workshop on Radiation Risk and its Origin at Molecular and Cellular Level, JAERI-Conf.. 5.3. 65-75 (2003)
日期 H:“用于现场传感和微剂量测量的 RISA 探测器的开发”国际辐射风险及其分子和细胞水平起源研讨会,JAERI-Conf.. 5.3。
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- 影响因子:0
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Development of TiO_2/Ceramics Radiation Detectors by Plasma CVD
等离子体CVD法研制TiO_2/陶瓷辐射探测器
- DOI:
- 发表时间:2004
- 期刊:
- 影响因子:0
- 作者:Date H;Takamasa T;Shimozuma M
- 通讯作者:Shimozuma M
Fundamental Study on Designing Radiation Detectors Using Radiation Induced Sure face Activation
利用辐射诱导的 Sure Face 激活设计辐射探测器的基础研究
- DOI:
- 发表时间:2004
- 期刊:
- 影响因子:0
- 作者:Date H;Takamasa T;Shimozuma M;Sawada T;下妻光夫;下妻光夫;Date H.;Takamasa T
- 通讯作者:Takamasa T
下妻光夫: "TiCl_4+O_2を用いたイオンアシストプラズマCVD法によるTiO_2膜の生成"応用物理学会学術講演会予稿集. 1a-ZG-6. 106-106 (2003)
Mitsuo Shimotsuma:“使用TiCl_4+O_2通过离子辅助等离子体CVD生产TiO_2薄膜”日本应用物理学会学术会议记录1a-ZG-6(2003)。
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- 发表时间:
- 期刊:
- 影响因子:0
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Shimozuma M: "Development of TiO_2/Ceramics Radiation Detectors by Plasma CVD"Proceedings of the 21^<th> Symposium on Plasma Processing. 21. 134-135 (2004)
Shimozuma M:“通过等离子体CVD开发TiO_2/陶瓷辐射探测器”第21届等离子体处理研讨会论文集。
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SHIMOZUMA Mitsuo其他文献
SHIMOZUMA Mitsuo的其他文献
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{{ truncateString('SHIMOZUMA Mitsuo', 18)}}的其他基金
Low Temperature Deposition of TiN Diffusion Barrier Metal for Integrated Circuit by Low Frequency Plasma CVD
低频等离子体CVD低温沉积集成电路用TiN扩散势垒金属
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10650298 - 财政年份:1998
- 资助金额:
$ 2.37万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Development of Low Temperature Deposition Process of Carbon Thin Film by Low Frequency 50Hz Plasma CVD.
低频50Hz等离子体CVD碳薄膜低温沉积工艺的开发。
- 批准号:
02555056 - 财政年份:1990
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$ 2.37万 - 项目类别:
Grant-in-Aid for Developmental Scientific Research (B)
Deveiopment of Room Temperature Deposition Process of Silicon Nitride Film by Low Frequency Plasma CVD.
低频等离子体CVD 氮化硅薄膜室温沉积工艺的发展。
- 批准号:
61850049 - 财政年份:1986
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$ 2.37万 - 项目类别:
Grant-in-Aid for Developmental Scientific Research
Selectively doped heterojunction CCD
选择性掺杂异质结CCD
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59850047 - 财政年份:1984
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$ 2.37万 - 项目类别:
Grant-in-Aid for Developmental Scientific Research
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