Research on 3-D Highly Precise Self-alignment Process Using Resin Material for Assembly of Optical Device

光学器件组装用树脂材料3D高精度自对准工艺研究

基本信息

批准号：
13450143
负责人：
FUJIMOTO Kozo
金额：
$ 9.66万
依托单位：
OSAKA UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

In resent years, along the advances of the information and communication apparatus, mass information are processe transmitted at high speed toward information and multimedia age and the need for miniaturization, higher mount de* lower cost and higher performance of advanced electronic packages have been accelerated. Furthermore, a research development of the high density surface mount technology (SMT) of electronic devices and the opto-electronic technolo* the consolidated optoelectronic multi-chip modules (OE-MCMs) of the optical devices (LD, PD, VCSEL, etc.) and elec* elements to an optical wiring board have been made remarkable progress. Especially, the highly precise alignment technologies have been required in high density SMT and interconnection of an optical devices and elements. In such a highly precise alignment technologies, it is necessary that new alternative self-alignment processes which are sufficient to process simply at low process temperature, low cost and without flux should be developed. The objective of this research is the developm* new alternative self-alignment processes which are sufficient to process simply at low process temperature, without flux* low cost. In this research, it is perceived that the positioning boundary of contact line resulted from the differen* wettability on the mounting material should be existed for the self-alignment capability. And new highly precise put* model, pull up model and 3-D model with metal sphere are established. The relationships between process-related paran* are demonstrated and design tool is developed using the mathematical single joint model. Also the self-alignment mechanism is established through the developed alignment dynamic model. At last, the practicabilities of deve* processes are verified through an analytic numerical method and self-alignment experiment.

近年来，随着信息和通信设备的进步，海量信息被高速处理传输，迈向信息和多媒体时代，并且加速了对先进电子封装的小型化、更高安装、更低成本和更高性能的需求。此外，电子器件的高密度表面贴装技术（SMT）和光学器件（LD、PD、VCSEL等）的光电技术*综合光电多芯片模块（OE-MCM）的研究进展。 ) 和 elec* 元件到光线路板已经取得了显着的进展。特别是，高密度SMT以及光学器件和元件的互连需要高精度对准技术。在如此高精度的对准技术中，有必要开发新的替代自对准工艺，该工艺足以在低工艺温度、低成本且无需助焊剂的情况下简单地进行加工。这项研究的目的是开发*新的替代自对准工艺，该工艺足以在低工艺温度下简单地进行加工，无需助焊剂*低成本。在这项研究中，我们认为，为了实现自对准能力，应存在由安装材料上的不同润湿性引起的接触线的定位边界。并建立了新的高精度放*模型、上拉模型和金属球体3D模型。论证了与过程相关的参数之间的关系，并使用数学单关节模型开发了设计工具。还通过开发的对准动态模型建立了自对准机制。最后，通过解析数值方法和自对准实验验证了deve*过程的实用性。