Study on Novel Surface Emitting Semiconductor Laser for Optically Integrated Multi-functional Optical Devices.

用于光集成多功能光学器件的新型表面发射半导体激光器的研究。

基本信息

  • 批准号:
    60460137
  • 负责人:
  • 金额:
    $ 4.74万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)
  • 财政年份:
    1985
  • 资助国家:
    日本
  • 起止时间:
    1985 至 1986
  • 项目状态:
    已结题

项目摘要

It is rather difficult for conventional semiconductor lasers to form 2 dimentional monolithical integration, since they use cleaving to form optical cavitys. In this study, new type of surface emitting laser named Coaxial Transverse Junction (CTJ) is proposed and fabricated for the first time. The CTJ structure is fabricated as follows; the column or well structure is formed by the reactive ion etching onto the n-GaAs/n-AlGaAs/n-GaAs DH wafer, whose side wall is perpendicular to the substrate. Then Zn is diffused to form the pn junction parallel to the side wall. In this structure the length of the active region is corresponded to that of the side wall, so that the relatively latge amplified gain is obtained along the emission direction perpendicular to the substrate.We have investigated three different types of CTJ family called Column type CTJ (C-CTJ), Well type CTJ (W-CTJ) and Hole type CTJ (H-CTJ). In these variations, H-CTJ structure is most suitable for lasing operation, since it does not contain unnecessary layer within the optical resonator. Lasing operation was confirmed by the current-light output characteristic and also the oscillation spectra using H-CTJ sample at 10K. The threshold current was 90 mA. Based on the present data, the threshold current for the room temperature operation of the H-CTJ laser was estimated to be about 200 mA with 90% reflectivity of the mirror. To obtain lower threshold operation, it is necessary to optimize Zn diffusion process and the dimension of the structure. Though these problems are left to solve, the present study shows the fundamental properties of the CTJ structure and its superior properties for 2D applications.
传统半导体激光器采用劈裂方式形成光腔,形成二维单片集成相当困难。在这项研究中,首次提出并制造了名为同轴横向结(CTJ)的新型表面发射激光器。 CTJ结构的制作如下;通过反应离子刻蚀在n-GaAs/n-AlGaAs/n-GaAs DH晶片上形成柱或阱结构,其侧壁垂直于衬底。然后Zn扩散形成平行于侧壁的pn结。在这种结构中,有源区的长度与侧壁的长度相对应,从而沿着垂直于衬底的发射方向获得相对较大的放大增益。我们研究了三种不同类型的CTJ系列,称为柱式CTJ( C-CTJ)、井式CTJ(W-CTJ)和孔式CTJ(H-CTJ)。在这些变体中,H-CTJ 结构最适合激光操作,因为它在光学谐振腔内不包含不必要的层。激光操作通过电流-光输出特性以及使用 H-CTJ 样品在 10K 下的振荡光谱得到证实。阈值电流为90mA。根据目前的数据,在镜面反射率为 90% 的情况下,H-CTJ 激光器在室温下工作的阈值电流估计约为 200 mA。为了获得更低的阈值操作,有必要优化Zn扩散过程和结构尺寸。尽管这些问题有待解决,但本研究展示了 CTJ 结构的基本特性及其在 2D 应用中的优越特性。

项目成果

期刊论文数量(12)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
稲場文男: 東北大学電通談話会記録. 53. 118-124 (1985)
稻叶文雄:东北大学电通学术讨论会记录。53. 118-124 (1985)。
  • DOI:
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    0
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  • 通讯作者:
H.Yamada: "Anisotropic Reactive Ion Etching Technique of GaAs and AlGaAs Materials for Integrated Optical Device Fabrication." J. Vacuum Science and Technology B. 3. 884-888 (1985)
H.Yamada:“用于集成光学器件制造的 GaAs 和 AlGaAs 材料的各向异性反应离子蚀刻技术”。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
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  • 通讯作者:
N.Zhang: "Bandwidth-Limited, Single-Longitudinal-Mode, Ultrashort Optical Pulse Generation by a Strongly RF-Modulated Distributed Bragg Reflector InGaAsP Diode Laser at 1.3 um." Electronics Letters. 22. 1194-1196 (1986)
N.Zhang:“通过强射频调制分布式布拉格反射器 InGaAsP 二极管激光器在 1.3 微米处生成带宽受限、单纵模、超短光脉冲。”
  • DOI:
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  • 影响因子:
    0
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  • 通讯作者:
N.Zhang: Electronics Letters. 25. 1194-1196 (1986)
N.Zhang:电子通讯。
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  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
H.Inaba: "Studies on Coaxial Transverse Junction Type Laser Diode / Light Emitting Diode and Two-Dimensionally Integrated Optical Functional Devices." The REcord of Electrical and Communication Engineering Converzione Tohoku University. 53. 118-124 (1985)
H.Inaba:“同轴横向结型激光二极管/发光二极管和二维集成光学功能器件的研究”。
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    0
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ITO Hiromasa其他文献

ITO Hiromasa的其他文献

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{{ truncateString('ITO Hiromasa', 18)}}的其他基金

Ultra wide-band (1-100THz), quasi-CW monochromatic THz-wave source system
超宽带(1-100THz)、准连续单色太赫兹波源系统
  • 批准号:
    19206009
  • 财政年份:
    2007
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
Research of a Next-Generation Laser Tsunami Measurement Network system
下一代激光海啸测量网络系统研究
  • 批准号:
    11358005
  • 财政年份:
    1999
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
Correlation Domain Spectroscopy by Frequency-Chirped Light
频率啁啾光的相关域光谱
  • 批准号:
    10450031
  • 财政年份:
    1998
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
A study on fundamentals and applications of a fuzzy mode laser
模糊模激光器原理及应用研究
  • 批准号:
    07455030
  • 财政年份:
    1995
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Research on Multi-Functional Nonlinear-Optic Devices using Domain Superlattices
利用域超晶格的多功能非线性光学器件研究
  • 批准号:
    06555012
  • 财政年份:
    1994
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
Fundamental Research on All Optical Submillimeter Wave Generation and Detection System
全光学亚毫米波发生与检测系统基础研究
  • 批准号:
    05452107
  • 财政年份:
    1993
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)
PULSEWIDTH CONTROL OF ULTRA-SHORT OPTICAL PULSES GENERATED FROM SEMICONDUCTOR LASER DIODE BY OPTICAL PULSE COMPRESSION METHOD
光脉冲压缩方法对半导体激光二极管产生的超短光脉冲的脉宽控制
  • 批准号:
    62460063
  • 财政年份:
    1987
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)

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MRI:轨道 1 采购深度反应离子蚀刻系统以增强半导体加工能力
  • 批准号:
    2320476
  • 财政年份:
    2023
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    $ 4.74万
  • 项目类别:
    Standard Grant
Functional extension and upgrade of a reactive ion etching tool
反应离子刻蚀工具的功能扩展和升级
  • 批准号:
    495043546
  • 财政年份:
    2021
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Major Research Instrumentation
Reactive ion etching
反应离子蚀刻
  • 批准号:
    423610064
  • 财政年份:
    2019
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Major Research Instrumentation
Electrically pumped ZnO-based UV polariton laser operating at room temperature
室温下工作的电泵浦 ZnO 基紫外偏振激元激光器
  • 批准号:
    19K15453
  • 财政年份:
    2019
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Grant-in-Aid for Early-Career Scientists
In-situ etch depth control with precision around 1 nm via reflectance anisotropy spectroscopy during reactive ion etching of monocrystalline III/V semiconductors
在单晶 III/V 半导体的反应离子蚀刻过程中,通过反射各向异性光谱进行原位蚀刻深度控制,精度约为 1 nm
  • 批准号:
    333645568
  • 财政年份:
    2017
  • 资助金额:
    $ 4.74万
  • 项目类别:
    Research Grants
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