Collaborative Research: FuSe:Substrate-inverted Multi-Material Integration Technology

合作研究：FuSe：衬底倒置多材料集成技术

• 批准号: 2328841
• 负责人: Jifeng Liu
• 金额: $ 36万
• 依托单位: Dartmouth College
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-11-01 至 2026-10-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2328841&HistoricalAwards=false
• 关键词: Collaborative; Research; FuSe; Substrate; inverted

Heterogeneous integration of new materials promises to significantly expand the range of capabilities accessible by silicon photonic integrated circuits (PICs). However, classical integration protocols require custom deep etching through the top layers to access the photonic devices underneath, and thus face severe limitations in integration capacity, density, and process complexity. This program will explore co-design of new materials, integration processes, device architectures, and packaging solutions to realize a transformative universal heterogeneous integration platform: Substrate-inverted Multi-Material Integration Technology (SuMMIT). Upon success, the SuMMIT platform will significantly expand and expedite heterogeneous photonic integration of new materials—a key driving force for PIC technology advances. The program will also strengthen academia-industry partnership and workforce development through development of both online and in-person photonics training programs.The SuMMIT integration scheme leverages advanced wafer-scale 3-D packaging technologies such as through-Si vias and direct bond interconnects to enable seamless integration of materials traditionally considered incompatible with complementary metal-oxide semiconductor processing. Another innovative aspect of the proposed scheme is the use of through-Si vias to establish a bi-facial electrical and optical interconnect configuration, which offers much higher interconnect density and improved electrical performance such as latency and power consumption as compared to peripheral wire-bonding. Furthermore, the SuMMIT platform opens up a plethora of design concepts creatively re-purposing existing components and structures in industry-standard PICs towards facilitating heterogeneous integration. The program’s focus on building on standard PIC processes and structures with minimal customization facilitates industry adoption of the innovations and their integration into the existing semiconductor manufacturing ecosystem.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

新材料的异质集成有望显着扩展硅光子集成电路（PIC）的功能范围。然而，传统的集成协议需要通过顶层进行定制深蚀刻才能访问下面的光子器件，因此在集成方面面临着严重的限制。该项目将探索新材料、集成工艺、器件架构和封装解决方案的协同设计，以实现变革性的通用异构集成平台：基板反转多材料集成技术。一旦成功，SuMMIT 平台将显着扩展和加速新材料的异构光子集成——这是 PIC 技术进步的关键驱动力。该计划还将通过在线和线下开发加强学术界与工业界的合作和劳动力发展。 SuMMIT 集成方案利用先进的晶圆级 3D 封装技术，例如硅通孔和直接键合互连，以实现传统上被认为与互补材料不兼容的材料的无缝集成所提出方案的另一个创新方面是使用硅通孔来建立双面电气和光学互连配置，该配置提供更高的互连密度和改进的电气性能，例如延迟和功耗。此外，与外围引线键合相比，SuMMIT 平台开创了多种设计概念，创造性地重新利用行业标准 PIC 中的现有组件和结构，从而促进异构集成。定制促进了行业对创新的采用以及将其集成到现有的半导体制造生态系统中。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力优点和更广泛的影响审查标准进行评估，被认为值得支持。