PFI-TT: Developing Fiber to Chip Fusion for Advanced Photonic Packaging

PFI-TT：开发用于先进光子封装的光纤到芯片融合

• 批准号: 2140871
• 负责人: Jaime Cardenas
• 金额: $ 25万
• 依托单位: University of Rochester
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-02-01 至 2025-01-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2140871&HistoricalAwards=false
• 关键词: PFI; TT; Developing; Fiber; Chip

The broader impact/commercial potential of this Partnerships for Innovation – Technology Translation (PFI-TT) project is to enable the improve the performance of communications within data centers. Data traffic in data centers has tripled since 2016 and will continue to grow. Data centers are central to our interconnected way of life and have become critical as remote meetings and online interactions become commonplace. The proposed technology is a device capable of managing these higher volumes of activity.The proposed project will significantly reduce the cost of attaching arrays of fibers and specialty fibers to silicon photonic transceiver devices. Silicon photonic devices offer unparalleled performance and low cost by leveraging the CMOS electronics manufacturing infrastructure; however, up to 80% of the cost of a photonic device is in the packaging, and the main cost driver is permanently attaching optical fibers to the silicon photonic chip. The proposed project will develop the novel technology developed to permanently attach a fiber to a photonic chip using fusion splicing to address the needs of optical transceivers for datacenters. The proposed project will develop the process of fusing (i) arrays of up to twelve fibers, (ii) polarization maintaining fibers, and (iii) high numerical aperture fibers to enable next generation, high bandwidth optical transceivers.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该创新合作伙伴关系 - 技术转化 (PFI-TT) 项目的更广泛影响/商业潜力是提高数据中心内的通信性能 自 2016 年以来，数据中心的数据流量增加了两倍，并将继续增长。是我们互联生活方式的核心，并且随着远程会议和在线交互变得司空见惯，它变得至关重要。拟议的技术是一种能够管理这些大量活动的设备。拟议的项目将显着降低连接光纤阵列和光纤的成本。专业光纤到硅光子收发器器件通过利用 CMOS 电子制造基础设施，硅光子器件可提供无与伦比的性能和低成本；然而，高达 80% 的光子器件成本来自于封装，而主要的成本驱动因素是永久连接。拟议项目将开发新技术，通过熔接将光纤永久连接到光子芯片，以满足数据中心光收发器的需求。拟议项目将开发融合 (i) 多达 12 根光纤的阵列、(ii) 保偏光纤和 (iii) 高数值孔径光纤的工艺，以实现下一代高带宽光收发器。该奖项反映了 NSF 的法定使命通过使用基金会的智力优点和更广泛的影响审查标准进行评估，并被认为值得支持。

项目成果

Fiber array to chip attach using laser fusion splicing for low loss

使用激光熔接将光纤阵列连接到芯片以实现低损耗

• DOI: 10.1364/oe.492752
• 发表时间: 2023
• 期刊: Optics Express
• 影响因子: 3.8
• 作者: Nauriyal, Juniyali;Song, Meiting;Zhang, Yi;Granados-Baez, Marissa;Cardenas, Jaime
• 通讯作者: Cardenas, Jaime

Low-loss, Single-shot Fiber-Array to Chip Attach Using Laser Fusion Splicing

使用激光熔接实现低损耗、单次光纤阵列到芯片的连接

• DOI: 10.1109/ipc53466.2022.9975465
• 发表时间: 2022
• 期刊: IEEE
• 作者: Nauriyal, Juniyali;Zhang, Yi;Song, Meiting;Cardenas, Jaime
• 通讯作者: Cardenas, Jaime

Low-Loss, High Extinction Ratio Fiber to Chip Connection via Laser Fusion for Polarization Maintaining Fibers

通过激光熔合实现保偏光纤的低损耗、高消光比光纤与芯片连接

• DOI: 10.1364/ofc.2023.m3c.1
• 发表时间: 2023
• 期刊: Optica Publishing Group
• 作者: Kumar, Sushant;Nauriyal, Juniyali;Cardenas, Jaime
• 通讯作者: Cardenas, Jaime