SaTC: TTP: Medium: Collaborative: RESULTS: Reverse Engineering Solutions on Ubiquitous Logic for Trustworthiness and Security

SaTC：TTP：媒介：协作：结果：针对可信性和安全性的普适逻辑的逆向工程解决方案

基本信息

批准号：
1703602
负责人：
Jia Di
金额：
$ 34.96万
依托单位：
University of Arkansas
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2017
资助国家：
美国
起止时间：
2017-08-01 至 2021-07-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=1703602&HistoricalAwards=false
关键词：
SaTC TTP Medium Collaborative RESULTS

项目摘要

Due to the globalization of the integrated circuit (IC) supply chain, the reduction of manufacturing costs and the need for shorter time to market, commercial-off-the-shelf ICs are now prevalent in modern electronic systems. However, the wide usage of such components breeds major security and trust concerns. Validating the security and trustworthiness of these components is extremely challenging since the end user does not have access to the design details. Furthermore, the cost to patch hardware level design flaws and/or hardware Trojans always costs more than patching eventual software vulnerabilities.This project develops an automated trustworthiness and security analysis framework to help end-users address their concerns by reconstructing the behavioral description of commercial-off-the-shelf ICs and analyzing such description for functionality identification and detection of design flaws and/or potentially inserted hardware Trojans and backdoors. This tool suite offers an all-in-one technology to allow engineers to quickly go from physical circuit structure/netlists to behavior/specification and validate the security and trustworthiness of any digital ICs, through data-path and state register identification, state transition graph construction and decomposition, data flow recovery, high-level behavioral design reconstruction, and whitelist- and blacklist-based functionality determination and hardware Trojan/backdoor detection. As a Transition to Practice (TTP) project, the research team is also closely collaborating with an industrial partner in developing, integrating, and validating the tool suite, so that a holistic and practice-oriented hardware security tool suite is provided for protecting the IC supply chain.

由于集成电路 (IC) 供应链的全球化、制造成本的降低以及缩短上市时间的需要，商用现成 IC 现在在现代电子系统中普遍存在。然而，此类组件的广泛使用引发了重大的安全和信任问题。验证这些组件的安全性和可信度极具挑战性，因为最终用户无法访问设计细节。此外，修补硬件级设计缺陷和/或硬件木马的成本始终高于修补最终的软件漏洞。该项目开发了一个自动化的可信度和安全分析框架，通过重建商业行为描述来帮助最终用户解决他们的担忧。现成的 IC 并分析此类描述，以进行功能识别和检测设计缺陷和/或潜在插入的硬件木马和后门。该工具套件提供了一种一体化技术，使工程师能够通过数据路径和状态寄存器识别、状态转换图快速从物理电路结构/网表转向行为/规范，并验证任何数字 IC 的安全性和可信性构建和分解、数据流恢复、高级行为设计重构、基于白名单和黑名单的功能确定和硬件木马/后门检测。作为过渡到实践（TTP）项目，研究团队还与工业合作伙伴密切合作开发、集成和验证工具套件，从而为保护IC提供整体且面向实践的硬件安全工具套件供应链。