CRII: SHF: WINGS -- Wireless Interconnects for Next-Generation Systems

CRII:SHF:WINGS——下一代系统的无线互连

基本信息

  • 批准号:
    1565656
  • 负责人:
  • 金额:
    $ 17.5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2016
  • 资助国家:
    美国
  • 起止时间:
    2016-03-01 至 2020-02-29
  • 项目状态:
    已结题

项目摘要

The development of low-latency, energy-efficient, and reconfigurable on-chip wireless interconnect infrastructure has the potential for reducing the carbon footprint of electronic systems. This research will be integrated with the graduate-level courses on design of VLSI and Nano-electronic devices to be taught by the PI at her institution. The dissemination of open-source software generated in this research via nano-HUB facilities at Purdue University is expected to provide significant impact by serving a broad community of students, researchers, and engineers. Further, the software generated in this research will be used for in-class projects and assignments providing students with a unique opportunity to learn about Exascale computing without abstracting the fundamentals of device physics. Undergraduate students will be advised through the undergraduate summer research program at NYU School of Engineering. Participation of the PI in National Center for Women in Technology program at NYU will facilitate involvement of underrepresented minorities in the research program. The technical objective of this research is to make major advances in the design and optimization of on-chip communications infrastructure by exploiting plasma waves in graphene to implement waveguides and nanoantennas. By marrying disparate technologies - CMOS electronics and graphene plasmonics - a new heterogeneous architecture is proposed to enable terahertz-band communication between several computing elements within a range of 10 cm. The project will develop an analytical model-based benchmarked design space exploration of the interconnect architecture covering implementation aspects (area and energy) and network-level consideration (number of cores and network architecture). Overall, this research will drive connectivity to the full potential of scaled CMOS by improving communication bottleneck in a heterogeneous computing environment.
低延迟,节能和可重新配置的无线互连基础设施的发展具有减少电子系统的碳足迹的潜力。这项研究将与有关VLSI和纳米电子设备设计的研究生级课程集成,由PI在其机构中教授。预计通过普渡大学的纳米枢纽设施生成的开源软件的传播预计将通过为广泛的学生,研究人员和工程师服务提供重大影响。此外,本研究中生成的软件将用于课堂项目和作业,为学生提供了一个独特的机会,可以在不抽象设备物理基础的情况下了解Exascale计算。本科生将通过纽约大学工程学院的本科夏季研究计划提供建议。 PI参加纽约大学国家技术妇女技术中心的参与将有助于少数群体参与研究计划。这项研究的技术目的是通过利用石墨烯中的等离子体波来实施波导和纳米antennans来实现芯片通信基础架构的设计和优化。通过嫁给不同的技术 - CMOS电子和石墨烯等烯基 - 提出了一种新的异质体系结构,以在10厘米范围内的几个计算元素之间启用Terahertz波段通信。 该项目将开发基于分析模型的基准设计空间探索,涵盖实施方面(区域和能源)以及网络级别的考虑(核心和网络体系结构的数量)的互连体系结构。总体而言,这项研究将通过在异构计算环境中改善通信瓶颈来推动连通性的全部潜力。

项目成果

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Shaloo Rakheja其他文献

Shaloo Rakheja的其他文献

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{{ truncateString('Shaloo Rakheja', 18)}}的其他基金

CAREER: A multi-scale and hierarchical computational framework to model III-nitride devices operating in the near-terahertz regime
职业:多尺度和分层计算框架,用于模拟在近太赫兹区域运行的 III 族氮化物器件
  • 批准号:
    2237663
  • 财政年份:
    2023
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Continuing Grant
IUCRC Phase I: University of Illinois at Urbana-Champaign (UIUC): Center for Advanced Semiconductor Chips with Accelerated Performance (ASAP)
IUCRC 第一阶段:伊利诺伊大学厄巴纳-香槟分校 (UIUC):具有加速性能的先进半导体芯片中心 (ASAP)
  • 批准号:
    2231625
  • 财政年份:
    2023
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Continuing Grant
2022 Device Research Conference
2022年器件研究会议
  • 批准号:
    2227544
  • 财政年份:
    2022
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Standard Grant
79th Device Research Conference. To Be Held Virtually June 20-23, 2021.
第 79 届设备研究会议。
  • 批准号:
    2133323
  • 财政年份:
    2021
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Standard Grant
IUCRC Planning Grant University of Illinois: Center for Aggressive Scaling by Advanced Processes for Electronics and Photonics (ASAP)
IUCRC 规划拨款伊利诺伊大学:电子和光子学先进工艺积极扩展中心 (ASAP)
  • 批准号:
    2052749
  • 财政年份:
    2021
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Standard Grant
SHF: EAGER: Toward Energy-Efficient Heterogeneous Computing Integrating Polymorphic Magnetic and CMOS Devices
SHF:EAGER:迈向集成多态磁性和 CMOS 器件的节能异构计算
  • 批准号:
    1930620
  • 财政年份:
    2019
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Standard Grant
SHF: EAGER: Toward Energy-Efficient Heterogeneous Computing Integrating Polymorphic Magnetic and CMOS Devices
SHF:EAGER:迈向集成多态磁性和 CMOS 器件的节能异构计算
  • 批准号:
    2021230
  • 财政年份:
    2019
  • 资助金额:
    $ 17.5万
  • 项目类别:
    Standard Grant

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