CAREER: Glass-Based Fexible Integrated Photonic Devices
职业:玻璃基柔性集成光子器件
基本信息
- 批准号:1453218
- 负责人:
- 金额:$ 50万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2015
- 资助国家:美国
- 起止时间:2015-02-15 至 2020-01-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Abstract Title: Glass-based flexible integrated photonic devicesAbstract:Conventional integrated photonic devices are fabricated almost exclusively on rigid substrates such as silicon wafers. The proposed program aims to develop the fundamental optical physics and device processing know-how that enable photonic integration on unconventional flexible plastic substrates. By imparting mechanical flexibility to photonic structures, the research will advance understanding into optical and mechanical interaction mechanisms in the nanoscale, and open up emerging application venues including humanlike robotic skins, prosthetic limbs, minimally invasive surgical tools, and touch panels for flexible consumer electronics. The scientific research will be tightly integrated with curriculum development, undergraduate student training, and development of hands-on modules for optics education. Research outcome from the project will be incorporated into a new course on amorphous materials the PI will develop. In addition to augmenting classroom education at MIT, the program will also promote the free sharing and distribution of knowledge by developing online courses through the edX initiative. The participating undergraduate and graduate researchers will benefit from the interdisciplinary research as well as cross-cutting collaborations to extend their technical experiences. The program will also develop hands-on modules for K-12 students and the general public to promote public awareness of optical sciences and nanotechnology through working with the MIT Edgerton Center and local museums.Flexible photonics is uniquely poised at the nexus between photonics, mechanics, and materials sciences. While previously the topic has largely been explored from the three isolated fields, the proposed research will pioneer an interdisciplinary approach synergistically combining innovative photonic design, nano-mechanical engineering, and unconventional material processing to unravel the rich physics underlying tensorial strain-optical interactions and apply the principle to multidirectional stress measurement. Glasses, the backbone materials for lenses and fibers, will be explored as the preferred optical materials for photonic integration onto unconventional plastic substrates exploiting their low optical losses and extreme processing versatility, as they can be monolithically deposited on virtually any technically important substrate and can be shaped into functional device forms via traditional lithography or soft lithographic methods including molding, imprint, and ink jet printing. Further, while traditional planar photonic circuits on flat substrates are 2-D in nature, the proposed research will utilize the additional geometric degrees of freedom conferred by mechanical flexibility to create a 3-D photonics platform based on planar microfabrication, a technology that will enable pinpointing light-matter interaction locations in a 3-D space inaccessible to conventional "flat" photonics and thus will have immense application potentials for sensing, communications, and imaging.
摘要标题:基于玻璃的柔性集成光子设备的摘要:常规的集成光子设备几乎完全在刚性基板(例如硅晶片)上制造。拟议的计划旨在开发基本的光学物理和设备处理知识,以实现非常规柔性塑料底物的光子整合。通过将机械灵活性赋予光子结构,该研究将提高纳米级的光学和机械相互作用机制的理解,并为包括人类的机器人皮肤,假体肢体,微创的庞然大物工具以及灵活消费电子电子设备的触摸面板开放新兴的应用场所。科学研究将与课程开发,学生培训本科生培训以及用于光学教育的动手模块的开发紧密融合。该项目的研究结果将纳入PI将开发的有关无定形材料的新课程中。除了增加麻省理工学院的课堂教育外,该计划还将通过EDX计划开发在线课程来促进知识的自由共享和分发。参与的本科生和研究生研究人员将从跨学科研究以及跨剪裁合作中受益,以扩展其技术经验。该计划还将为K-12学生和公众开发动手模块,以通过与MIT Edgerton中心和当地博物馆合作,以提高公众对光学科学和纳米技术的认识。FlexiblePhotonics在光子学,机械学,机制,机械学,机械学,机械学,机械学,机械学之间唯一地位和材料科学。虽然以前的主题很大程度上是从三个孤立的领域探索的,但拟议的研究将开创一种跨学科方法,以协同结合创新的光子设计,纳米机械工程和非常规的材料处理,以揭示丰富的物理学的良好物理学的紧张互动和应用紧张的相互作用,并运用良好的物理。多向应力测量的原理。玻璃是镜头和纤维的骨干材料,将被探索为光子整合到非常规的塑料基板上,利用其低光学损失和极端处理的多功能性,因为它们可以单一地沉积在几乎任何技术重要的底物上,并且可以单一地沉积在任何技术上重要的底物上,并且可以是单一的。通过传统光刻或软版印刷方法(包括成型,烙印和墨水打印)形成功能设备形式。此外,虽然平坦基材上的传统平面光子电路本质上是2D,但拟议的研究将利用机械灵活性赋予的其他几何自由度,以创建基于平面微工艺的3-D光子平台,这项技术将启用该技术在3-D空间中指出了未接近常规“ Flat”光子学的3-D空间中的相互作用位置,因此将具有巨大的传感,通信和成像的应用潜力。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Juejun Hu其他文献
Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications
特邀)用于传感和通信的机械柔性集成光子系统
- DOI:
- 发表时间:
2017 - 期刊:
- 影响因子:0
- 作者:
Lan Li;Hongtao Lin;Jérôme Michon;S. Geiger;Junying Li;Hanyu Zheng;Yizhong Huang;A. Yadav;K. Richardson;T. Gu;Juejun Hu - 通讯作者:
Juejun Hu
Photonic Tensor Core with Photonic Compute-in-Memory
具有光子内存计算功能的光子张量核心
- DOI:
10.1364/ofc.2022.m2e.4 - 发表时间:
2022 - 期刊:
- 影响因子:0
- 作者:
Xiaoxuan Ma;Jiawei Meng;N. Peserico;M. Miscuglio;Yifei Zhang;Juejun Hu;V. Sorger - 通讯作者:
V. Sorger
Performance Optimization Strategies for Nanophotonic Digital Fourier Transform Spectrometers
纳米光子数字傅里叶变换光谱仪的性能优化策略
- DOI:
10.1364/fts.2019.ftu4b.5 - 发表时间:
2019 - 期刊:
- 影响因子:0
- 作者:
D. Kita;C. Ríos;Juejun Hu - 通讯作者:
Juejun Hu
A substrate-blind platform for photonic integration
用于光子集成的盲基板平台
- DOI:
10.1117/2.1201410.005643 - 发表时间:
2014 - 期刊:
- 影响因子:0
- 作者:
Juejun Hu - 通讯作者:
Juejun Hu
Integration of Free-Form Micro-Optics with PICs for Sensing, Packaging, and Optical Manipulation
自由曲面微光学器件与 PIC 的集成,用于传感、封装和光学操作
- DOI:
- 发表时间:
2022 - 期刊:
- 影响因子:0
- 作者:
Luigi Ranno;Shaoliang Yu;Qingyang Du;Samuel Serna;C. McDonough;Nicholas M. Fahrenkopf;T. Gu;Juejun Hu - 通讯作者:
Juejun Hu
Juejun Hu的其他文献
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{{ truncateString('Juejun Hu', 18)}}的其他基金
Collaborative Research: FuSe:Substrate-inverted Multi-Material Integration Technology
合作研究:FuSe:衬底倒置多材料集成技术
- 批准号:
2328839 - 财政年份:2023
- 资助金额:
$ 50万 - 项目类别:
Continuing Grant
Collaborative Research: FuSe: High-throughput Discovery of Phase Change Materials for Co-designed Electronic and Optical Computational Devices (PHACEO)
合作研究:FuSe:用于共同设计的电子和光学计算设备的相变材料的高通量发现(PHACEO)
- 批准号:
2329088 - 财政年份:2023
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Collaborative Research: Combinatorial solution processing of optical phase change materials
合作研究:光学相变材料的组合溶液加工
- 批准号:
2225968 - 财政年份:2022
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
PFI-RP: A high-performance, low-cost chip-scale platform for medical imaging
PFI-RP:用于医学成像的高性能、低成本芯片级平台
- 批准号:
2122581 - 财政年份:2021
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
ASCENT: PROWESS: Phase-change Reconfigurable Optical WavEfront Synthesis System
ASCENT:PROWESS:相变可重构光波前合成系统
- 批准号:
2132929 - 财政年份:2021
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Collaborative Research: Tellurene mid-infrared integrated photonics
合作研究:碲烯中红外集成光子学
- 批准号:
2023987 - 财政年份:2020
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
I-Corps: 6Sensing: Chip-scale Raman sensors
I-Corps:6Sensing:芯片级拉曼传感器
- 批准号:
1851293 - 财政年份:2018
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Collaborative Research: Conformal and robust integrated infrared spectroscopic sensors
合作研究:共形且坚固的集成红外光谱传感器
- 批准号:
1709212 - 财政年份:2017
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
Collaborative Research: Thin-Film Chalcogenide Glass Materials for High-Quality Integrated Photonics
合作研究:用于高质量集成光子学的薄膜硫系玻璃材料
- 批准号:
1506605 - 财政年份:2015
- 资助金额:
$ 50万 - 项目类别:
Continuing Grant
Workshop -- Support to Students to Attend IEEE Photonics Society Summer Topical Conferences, Montreal, July 14-16, 2014
研讨会——支持学生参加 IEEE 光子学协会夏季专题会议,蒙特利尔,2014 年 7 月 14 日至 16 日
- 批准号:
1439933 - 财政年份:2014
- 资助金额:
$ 50万 - 项目类别:
Standard Grant
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