Collaborative Research: FuSe:Substrate-inverted Multi-Material Integration Technology

合作研究：FuSe：衬底倒置多材料集成技术

• 批准号: 2328839
• 负责人: Juejun Hu
• 金额: $ 128万
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-11-01 至 2026-10-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2328839&HistoricalAwards=false
• 关键词: Collaborative; Research; FuSe; Substrate; inverted; Collaborative; Research; FuSe; Substrate; inverted

Heterogeneous integration of new materials promises to significantly expand the range of capabilities accessible by silicon photonic integrated circuits (PICs). However, classical integration protocols require custom deep etching through the top layers to access the photonic devices underneath, and thus face severe limitations in integration capacity, density, and process complexity. This program will explore co-design of new materials, integration processes, device architectures, and packaging solutions to realize a transformative universal heterogeneous integration platform: Substrate-inverted Multi-Material Integration Technology (SuMMIT). Upon success, the SuMMIT platform will significantly expand and expedite heterogeneous photonic integration of new materials—a key driving force for PIC technology advances. The program will also strengthen academia-industry partnership and workforce development through development of both online and in-person photonics training programs.The SuMMIT integration scheme leverages advanced wafer-scale 3-D packaging technologies such as through-Si vias and direct bond interconnects to enable seamless integration of materials traditionally considered incompatible with complementary metal-oxide semiconductor processing. Another innovative aspect of the proposed scheme is the use of through-Si vias to establish a bi-facial electrical and optical interconnect configuration, which offers much higher interconnect density and improved electrical performance such as latency and power consumption as compared to peripheral wire-bonding. Furthermore, the SuMMIT platform opens up a plethora of design concepts creatively re-purposing existing components and structures in industry-standard PICs towards facilitating heterogeneous integration. The program’s focus on building on standard PIC processes and structures with minimal customization facilitates industry adoption of the innovations and their integration into the existing semiconductor manufacturing ecosystem.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

新材料的异质整合有望显着扩大硅光子综合电路（图片）可访问的功能范围。但是，经典的集成协议需要在顶层进行自定义的深层蚀刻，才能访问下面的光子设备，从而面临着集成能力，密度和过程复杂性的严重限制。该计划将探讨新材料，集成过程，设备体系结构和包装解决方案的共同设计，以实现一个变革性的通用异质集成平台：融合基材的多物质集成技术（Summit）。成功后，峰会平台将大大扩展和加快新材料的异质光子整合，这是PIC技术进步的关键驱动力。该计划还将通过开发在线和面对面的光子学培训计划来加强学术界的伙伴关系和劳动力发展。峰会集成计划利用了先进的赌注尺度3-D包装技术，例如通过SI VIAS和直接键合连接互连，以实现与完整的金属氧化物的无缝集成的材料，以实现无效的集成。拟议方案的另一个创新方面是使用通过SI VIA来建立双种族的电气和光学互连配置，该配置提供了更高的互连密度和改善的电性能，例如与周围线束缚相比，延迟和功率消耗。此外，Summit平台为行业标准图片中的现有组件和结构创造性地打开了许多设计概念，以支持异质整合。该计划的重点是建立标准图片流程和结构，其最小的定制设施行业采用了创新及其在现有的半导体制造生态系统中的整合。该奖项反映了NSF的法定任务，并被认为是通过基金会的知识分子和更广泛影响的审查标准来通过评估来通过评估来获得的支持。