Workshop: Bugs and Defects in Electronic Systems: The Next Frontier

研讨会：电子系统中的错误和缺陷：下一个前沿

• 批准号: 1341270
• 负责人: Subhasish Mitra
• 金额: $ 2.25万
• 依托单位: Stanford University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-08-01 至 2014-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1341270&HistoricalAwards=false
• 关键词: Workshop; Bugs; Defects; Electronic; Systems

This Dagstuhl workshop is to bring together scientists from the research areas of Design Verification, Formal Methods, High-level Design, Manufacturing Testing, Robust System Design, and related disciplines in the context of integrated circuit manufacturing. The objective is to discuss major upcoming obstacles in the design, verification, and testing of robust systems and their potential solutions. Existing pre-silicon verification is insufficiently scalable, and today's manufacturing test methodologies may not be adequate in screening marginal and reliability failures. Bugs and defects that impact system correctness and/or security must be detected, localized, and corrected in the system environment, during post-silicon validation, or during system operation in the field. New methodologies, that are radical departures from today's practice and require multi-disciplinary effort spanning traditionally distinct research areas are to be discussed.The outcome of this workshop is expected to influence US semiconductor industry by making connections between the academic and industrial researchers. The industry experts present at the workshop will also be instrumental in the benchmarking efforts critical to the research in the field. The workshop will also use the technical topic as a means to assess the value of joint collaborations between the relevant US and German scientific communities and explore various collaboration mechanisms that can be supported by the respective funding agencies. To this end, the workshop is co-sponsored by the German Science Foundation (DFG) as well.

这个DAGSTUHL研讨会是将设计验证，正式方法，高级设计，制造测试，健壮的系统设计和相关学科的研究领域的科学家聚集在一起。目的是讨论鲁棒系统及其潜在解决方案的设计，验证和测试中的主要障碍。现有的硅前验证不足以扩展，当今的制造测试方法可能在筛查边际和可靠性失败方面不足。必须在系统环境，后硅验证期间或现场操作期间检测，本地化和纠正影响系统正确性和/或安全性的错误和缺陷。将要讨论新的方法论，即与当今的实践的根本性不同，需要跨越传统上不同的研究领域的多学科努力。该研讨会的结果有望通过在学术研究人员和工业研究人员之间建立联系来影响美国半导体行业。参加研讨会的行业专家也将在对该领域的研究至关重要的基准努力中发挥作用。研讨会还将使用技术主题来评估相关美国和德国科学社区之间的共同合作价值，并探索各种资助机构可以支持的各种协作机制。为此，研讨会也由德国科学基金会（DFG）共同赞助。