MRI: Acquisition of reactive ion etching and chemical vapor deposition instrument for electronic and optical device fabrication.

MRI：采购用于电子和光学器件制造的反应离子蚀刻和化学气相沉积仪器。

• 批准号: 1337711
• 负责人: Hailin Wang
• 金额: $ 21.77万
• 依托单位: University of Oregon Eugene
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-09-01 至 2015-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1337711&HistoricalAwards=false
• 关键词: MRI; Acquisition; reactive; ion; etching

DMR-1337711WangThis award from the Major Research Instrumentation Program supports the University of Oregon (UO) Eugene with the acquisition of an inductively-coupled plasma reactive ion etching instrument. The instrument will be housed in the semiconductor nanofabrication/characterization facility of the Center for Advanced Materials Characterization in Oregon (CAMCOR) at the UO. The instrument will greatly augment the nanofabrication capabilities at CAMCOR and will play an enabling role in a broad range of research programs at the UO and Oregon State University (OSU). The instrument will enable the fabrication of three-dimensional semiconductor nanostructures and hybrid inorganic semiconductor interfaces for solar energy and energy conversion applications, the fabrication of diamond nanopillars and microdisks for applications in quantum information processing, the development and understanding of the patterning chemistry of inorganic solution-processed films, and the fabrication of metallodielectric structured materials with unique nano-optical properties. The instrument will also be used for the UO Master's internship program in semiconductor devices and photovoltaics. As a part of CAMCOR, the instrument will directly enhance the research and education of a large number of graduate and undergraduate students. Non-technical abstract:The ability to controllably remove or add material from a surface is important for producing three-dimensional structures with nanometer-scale features. These features are critical for building and studying a variety of advanced materials and devices that are relevant to advancing new energy conversion and computing technologies. The Major Research Instrumentation program provides funds to support the University of Oregon (UO) with the acquisition of an inductively-coupled plasma reactive ion etching instrument. The instrument will provide state-of-the-art capabilities in etching (removing) and deposition (adding) of inorganic materials that are not currently available to researchers at both Oregon State University and the UO. The instrument will be housed in an open-access shared nanofabrication facility, the Center for Advanced Materials Characterization in Oregon (CAMCOR), on the UO campus and thus be professionally maintained and available for use by researchers in academia and industry throughout the region. The UO Master's internship program in semiconductor devices and photovoltaics will incorporate the use of the instrument into its curriculum, so that students entering industry are trained in this important technology.

主要研究仪器计划获得的DMR-1337711 Wangthis奖支持俄勒冈大学（UO）Eugene，并获得了电感耦合的等离子体等离子体反应性离子蚀刻工具。该仪器将安置在UO的俄勒冈州高级材料表征中心的半导体纳米制作/表征设施中。 该乐器将大大增强CAMCOR的纳米制作能力，并将在UO和俄勒冈州立大学（OSU）的各种研究计划中发挥有效作用。 The instrument will enable the fabrication of three-dimensional semiconductor nanostructures and hybrid inorganic semiconductor interfaces for solar energy and energy conversion applications, the fabrication of diamond nanopillars and microdisks for applications in quantum information processing, the development and understanding of the patterning chemistry of inorganic solution-processed films, and the fabrication of metallodielectric structured materials with unique纳米光学特性。 该仪器还将用于半导体设备和光伏的UO Master实习计划。 作为CAMCOR的一部分，该工具将直接增强大量研究生和本科生的研究和教育。 非技术摘要：从表面上删除或添加材料的能力对于生产具有纳米尺度特征的三维结构很重要。这些功能对于构建和研究与推进新的能源转换和计算技术相关的各种高级材料和设备至关重要。主要的研究仪器计划提供了资金来支持俄勒冈大学（UO），并获得了电感耦合的等离子体反应性离子蚀刻仪器。该工具将提供蚀刻（去除）和沉积（添加）无机材料的最先进功能，而俄勒冈州立大学和UO的研究人员目前都无法使用。该乐器将安置在开放式纳米制造设施，俄勒冈州（CAMCOR）的高级材料表征中心（CAMCOR）中，在UO校园中，因此可以专业维护并可供整个地区的学术界和行业研究人员使用。 UO Master's实习计划在半导体设备和Photovoltaics中将纳入其课程中的使用，以便对进入行业的学生进行这项重要技术的培训。