GOALI: Wafer-Level and Chip-Scale Packaging (WL-CSP) of MEMS

GOALI：MEMS 晶圆级和芯片级封装 (WL-CSP)

• 批准号: 0501597
• 负责人: Ajay Malshe
• 金额: --
• 依托单位: University of Arkansas
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-06-01 至 2010-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0501597&HistoricalAwards=false
• 关键词: GOALI; Wafer; Level; Chip; Scale

The objective of this research is to design, develop and test a novel wafer-level encapsulation and chip-scale interconnection scheme for packaging of micro electromechanical systems. Arrays of radio frequency micro electromechanical system switch devices on a wafer are chosen as a demonstration test bed. The goal is to implement and test capping high resistivity silicon, polymer and low temperature co-fired ceramic wafers, with through wafer metallized vias for encapsulation and interconnection of radio frequency micro electromechanical system switches on the device wafer. This project will be executed in an ongoing collaboration among the University of Arkansas, wiSpry, and Sandia National Laboratories. The success of the proposed technical approach will allow the industry to work on a wide gamut of micro electromechanical system devices operational in hermetic environments. These developments benefit micro electromechanical system packaging in strategic application areas of telecommunication, homeland security, biomedical devices, automotive and aerospace sensors, thin display and solid state lighting applications and fuel cells. The interdisciplinary expertise of the team will be conducive for the microsystems education of the students involved on this project. In the research, the special emphasis will be to recruit and nurture teaching, training and learning within underrepresented minorities. Investigators will continue to build their ongoing partnership with area school community and the experience will used to forge new relations with the area Community Colleges. Training is inevitable today- to the technology community particularly in the Midwest- to create and retain new high paid microsystems related jobs in America.

这项研究的目的是设计，开发和测试用于包装微机械系统包装的新型晶状层封装和芯片尺度互连方案。射频微电动系统开关设备的射程阵列被选择作为演示测试床。目的是实施和测试高电阻率硅，聚合物和低温共同燃烧的陶瓷晶片，并通过晶片金属化的VIA将射频微电动机电系统开关封装和互连设备晶圆。 该项目将在阿肯色大学，小威斯普里和桑迪亚国家实验室之间进行的持续合作中执行。拟议的技术方法的成功将使该行业能够在密封环境中运行的微电机电系统设备的广泛范围。这些发展使电信，国土安全性，生物医学设备，汽车和航空航天传感器，薄显示以及固态照明应用以及燃料电池的战略应用领域中有益于微电动系统包装。团队的跨学科专业知识将有助于对参与该项目的学生的微系统教育。在研究中，特别重点是在代表性不足的少数民族中招募和培养教学，培训和学习。 调查人员将继续与地区学校社区建立持续的合作伙伴关系，并且经验将用于与地区社区大学建立新的关系。今天，培训是不可避免的 - 对于技术界而言，尤其是在中西部 - 在美国创造和保留新的高薪微型系统相关的工作。