SBIR Phase II: Vertical Electroabsorptive Modulated Laser (EML) Source for High-Speed Interconnects

SBIR 第二阶段：用于高速互连的垂直电吸收调制激光 (EML) 源

• 批准号: 0450619
• 负责人: Majid Riaziat
• 金额: --
• 依托单位: OEPIC SEMICONDUCTORS, INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-06-15 至 2008-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0450619&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Vertical; Electroabsorptive

This SBIR Phase II project aims to fabricate and commercialize a Vertical Electro-absorptive Modulated Laser (V-EML) for high-speed (up to 40Gbps) optical interconnects for chip-to-chip, board-to-board, and intra-rack optical applications. Compared to current electrical data buses using copper interconnects or conventional fiber optic links, the V-EML will enable the fabrication of higher speed, lower cost, lower power consumption and smaller optical transmitters for multi-channel fiber optic data buses in computer and communication networks. This technology virtually removes the modulation speed limit of VCSEL optical transmitters. At the same time it maintains high channel density at low cost. The low power consumption of the V-EML (~20 mW) and its potential low cost in volume (~$1.0) will provide a solution to the interconnect speed and power barriers in multiprocessor computers and servers. An array spacing of 50 to 100 microns will be possible with V-EMLs. This means that an 8x8 array with 2.5 Tbps of capacity has less than 1.0 mm2 of footprint. This offers substantial space savings over the existing copper interconnect technology and creates another strong incentive for transition.This technology could provide societal benefits from the commercialization of this technology by enabling faster and more widespread deployment of broadband services. The potential for ultra-fast delivery of audiovisual information is enormous as the V-EML technology helps to remove data-com bottlenecks. Educational and scientific benefits of the V-EML development arise in the area of supercomputers with sufficient computing power for complex scientific simulations. Applications include climate modeling for better predictions, molecular level modeling such as protein folding in medicine, ecosystem modeling in agriculture, and large-scale analysis of business information and economic statistics. These computers could then operate much faster and much more efficiently when interconnect speed limits are increased.

该SBIR II期项目旨在为高速（高达40Gbps）光学互连用于芯片到芯片，板上到板上的板上和内部式光学应用程序的高速（高达40Gbps）光学互连，以制造和商业化垂直电动吸收调制激光（V-EML）。 与使用铜互连或常规光纤链路的当前电气数据总线相比，V-EML将能够为计算机和通信网络中的多通道光纤数据总线制造较高速度，较低的成本，较低的功耗和较小的光学发射器。该技术实际上消除了VCSEL光学发射器的调制速度限制。同时，它以低成本保持高通道密度。 V-EML（〜20 MW）的低功耗及其潜在的低成本（约1.0美元）将为多处理器计算机和服务器中的互连速度和功率屏障提供解决方案。通过V-EML，将可以使用50至100微米的阵列间距。 这意味着具有2.5 TBP的8x8阵列的占地面积小于1.0 mm2。 这为现有的铜互连技术提供了可观的空间节省，并为过渡提供了另一个强大的激励措施。这项技术可以通过使宽带服务更快，更广泛地部署这种技术来从该技术的商业化中提供社会利益。由于V-EML技术有助于消除数据com瓶颈，因此超快速传递的视听信息的潜力是巨大的。 V-EML发展的教育和科学益处在具有足够的计算能力的超级计算机领域出现，用于复杂的科学模拟。应用包括用于更好预测的气候建模，分子水平建模，例如医学中的蛋白质折叠，农业生态系统建模以及对业务信息和经济统计的大规模分析。然后，当互连速度限制增加时，这些计算机可以更快，更有效地操作。