一种独特的微通道热虹吸沸腾特性研究及其在新型3D堆叠芯片冷却中的应用

A new thermosyphon boiling or natural convective boiling theory in vertical and inclined micro-channels is originally proposed and applied to actual engineering technology of passive cooling of 3D chips. These micro-channels simulating the specific micro-channels structure of 3D chips, have specific micro-structure capillarity and thermosyphon, therefore, and have specific micro structure boiling heat transfer and two-phase flow characteristics. This study firstly provides a passive cooling technology of 3D chips which utilizes 3D chip’s itself micro-channels structure to form a micro-channels boiling with the driving force of the combination of buoyancy and micro-structure capillarity. Base on the specific micro-channel structures, basic natural convective boiling heat transfer characteristics and mechanism in various 2 and 3 dimensional micro-channels are found. Then on this basis, two passively enhanced heat transfer technologies are used to improve the cooling capacity. One is using various surfactants to form super-moist fluids, and another is using nanofluids and other surficial mechanical technologies to develop a porous coating on the chip’s surfaces. The experimental and theoretical studies will be carried out systemically to discover new boiling theory and technology support to 3D stacked chip cooling. In this study, design ideal, theoretical mechanism, key technologies and actual application all are original.

本研究提出了一种独特的竖直或倾斜3维微通道内热虹吸沸腾传热概念并将其应用于解决工业界3D堆叠芯片冷却技术难题。这种微通道结构模拟实际3D堆叠芯片微尺度结构，具有独特的微尺度毛细力和热虹吸现象，由此产生独特的自然对流沸腾换热和汽液两相流特性。本研究针对3D芯片本身的微通道几何特点，提出一个新颖的被动式3D芯片冷却概念并从实验和理论模拟两方面研究对应产生的各种2维和3维微通道沸腾特性和其技术应用问题。为了提高实际应用中的3D芯片冷却能力，被动式微通道沸腾换热强化技术也是本研究一个重要目标。针对微通道特点，本研究提出使用各种超湿润流体，各类纳米结构表面强化微通道自然对流沸腾，在基本掌握各类参数对传热强化的影响规律后，进行实用性技术优化。本研究对于微尺度传热学的发展和应用有很好的开拓意义。