Low Temperature Interconnections for High Performance Heterogeneous Integration

用于高性能异构集成的低温互连

• 批准号: 535349-2018
• 负责人: Danovitch, David
• 金额: $ 10.94万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=693844
• 关键词: Low; Temperature; Interconnections; Performance; Heterogeneous

To continue to increase performance, reduce cost and increase ubiquity through miniaturization, the next generation of innovative microelectronics must rely on integrating many disparate but highly performing functions and components available today into compact yet functionally superior systems. In many cases, the optimal component is not compatible with traditional soldering processes that demand temperatures in excess of 250°C. The alternatives of selecting reduced performance and/or higher cost components with sufficient temperature resistance or accepting a degradation of the temperature sensitive component both leave opportunity on the table. This project therefore proposes research to explore and implement low temperature interconnection materials, structures and processes into microelectronic packaging and thus remove the barriers to the integration of cost sensitive microelectronic components in high performance systems. By collaborating with industrial partner and global leader in microelectronics, IBM Canada, the solutions derived from this research will be optimally developed for cost-effective, globally competitive microelectronics production. The project will also contribute to environmentally conscience manufacturing by reducing energy consumption and improving component re-use.

为了通过小型化继续提高性能、降低成本并提高普及率，下一代创新微电子技术必须依赖于将当今可用的许多不同但高性能的功能和组件集成到紧凑但功能优越的系统中。在许多情况下，最佳组件并不是最佳的。与要求温度超过 250°C 的传统焊接工艺兼容，选择具有足够耐温性的性能降低和/或成本较高的组件或接受温度敏感组件的退化都为该项目留下了机会。提议研究探索低温互连材料、结构和工艺并将其应用到微电子封装中，从而消除在高性能系统中集成成本敏感的微电子元件的障碍。这项研究的成果将得到优化开发，用于具有成本效益、具有全球竞争力的微电子生产，该项目还将通过减少能源消耗和改善组件的再利用，为环保制造做出贡献。