Gold Stud Bump Flip chip Attach for Silicon Photonics Packaging

用于硅光子封装的金螺柱凸点倒装芯片连接

• 批准号: 513296-2017
• 负责人: Danovitch, David
• 金额: $ 1.82万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=639571
• 关键词: Gold; Stud; Bump; Flip; chip

The object of this research project is to initiate an assessment of Au stud bump flip chip attach of siliconphotonic (SiP) chips for the packaging of photonics modules of interest to the industrial partner TeraXion.Employing its scientific and industrial knowledge and expertise in 'flip-chip' type bonding technology prevalentin microelectronics packaging, the research team will strive to determine how such technology could beimplemented seamlessly within the unique requirements of TeraXion's modules. The research activities willfirst comprise the development of a Au stud bump process for SiP chips, then an evaluation of availablebonding approaches with the goal to assess their compatibility with TeraXion's requirements, followed by anoptical test assessment to verify the effects of the bonding process on Teraxion's chip integrity. This will resultin a first proof of principle of Au stud bump flip chip attach for SiP assembly in order to validate the potentialto transition TeraXion's modules to flip chip technologies and evaluate the effectiveness of the bonding processand propose directions for future activity. The outcome of this project will be to provide TeraXion with anincreased knowledge of flip chip-compatible bonding options and a path to more thoroughly evaluate the mostpromising interconnection options for the packaging of TeraXion photonics modules.

该研究项目的目的是启动对硅光子 (SiP) 芯片的金柱凸块倒装芯片连接的评估，用于封装工业合作伙伴 TeraXion 感兴趣的光子模块。芯片型键合技术在微电子封装中盛行，研究团队将努力确定如何在 TeraXion 模块的独特要求内无缝实施此类技术。研究活动将首先包括开发用于 SiP 芯片的金柱形凸块工艺，然后评估可用的键合方法，以评估其与 TeraXion 要求的兼容性，然后进行光学测试评估，以验证键合工艺对 Teraxion 芯片的影响正直。这将首次验证用于 SiP 组装的金柱凸块倒装芯片连接的原理，以验证 TeraXion 模块过渡到倒装芯片技术的潜力，评估键合工艺的有效性，并为未来活动提出方向。该项目的成果将为 TeraXion 提供更多关于倒装芯片兼容接合选项的知识，以及更全面地评估 TeraXion 光子模块封装最有前途的互连选项的途径。