Novel solder structures for high reliability flip chip applications - Scaling to high-density applications

适用于高可靠性倒装芯片应用的新型焊接结构 - 扩展到高密度应用

• 批准号: 567538-2021
• 负责人: Danovitch, David
• 金额: $ 9.11万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Idea to Innovation
• 财政年份: 2021
• 资助国家: 加拿大
• 起止时间: 2021-01-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=728680
• 关键词: Novel; solder; structures; reliability; flip

The proliferation of technology on our persons (smart phones, smart watches, medical monitoring) and within our modes of living (home assistants) and transportation (aided and autonomous driving) incite the microelectronics industry to develop systems that are increasingly powerful and reliable yet ever compact with lower power consumption and competitive cost. At the heart of these systems is the network of semiconductor chips that must connect with each other and to the outside world. Flip chip technology, using short, tiny (human hair size) metallic structures, is the leading edge means to effect such connections at the highest density and performance possible. Despite such capability, flip chip technology must continue to evolve in order to keep in step with system demands. Miniaturization is a key focal point. As densities increase and the structures are even tinier, it becomes more difficult to balance counteracting issues - solutions to maintain electrical integrity (using copper instead of solder, or changing the solder composition) come at the expense of mechanical integrity. Our invention resolves this balancing act by proposing a unique structure that actually changes during the overall flip chip interconnection process. An initially heterogeneous structure is produced using reasonable adaptations to the known manufacturing methods for producing solder interconnections. This structure increases mechanical resistance at critical points in the assembly process then changes before the end of assembly to create a final, homogeneous solder structure with optimized electrical properties for operation. We have demonstrated the structure and behavior at reasonably miniature geometries (150 micrometers) but recognize the need to scale down to the size (50 micrometers) required of future generations. We propose this project to evolve both the structure and its manufacturing methods to this smaller scale. Project success will enable a Canadian innovation to extend the reach of microelectronic interconnection technology.

我们个人（智能手机、智能手表、医疗监控）、生活方式（家庭助理）和交通（辅助和自动驾驶）中技术的激增促使微电子行业开发出越来越强大和可靠的系统结构紧凑，功耗更低，成本具有竞争力。这些系统的核心是半导体芯片网络，该网络必须相互连接并与外界连接。倒装芯片技术使用短而微小（人类头发大小）的金属结构，是以尽可能高的密度和性能实现此类连接的领先手段。尽管具有这样的能力，倒装芯片技术必须不断发展才能跟上系统需求。小型化是一个关键焦点。随着密度的增加和结构的更小，平衡抵消问题变得更加困难 - 保持电气完整性的解决方案（使用铜代替焊料，或改变焊料成分）是以牺牲机械完整性为代价的。我们的发明通过提出一种独特的结构来解决这种平衡问题，该结构在整个倒装芯片互连过程中实际上会发生变化。使用对用于产生焊料互连的已知制造方法的合理修改来产生最初的异质结构。这种结构增加了组装过程中关键点的机械阻力，然后在组装结束之前发生变化，以创建最终的均匀焊料结构，并具有优化的电气性能以供操作。我们已经展示了相当微型的几何形状（150 微米）的结构和行为，但认识到需要缩小到后代所需的尺寸（50 微米）。我们建议这个项目将结构及其制造方法发展到更小的规模。项目的成功将使加拿大的创新能够扩大微电子互连技术的范围。