Characterisation of soldered and adhesively bonded assemblies in photonic packages

光子封装中焊接和粘合组件的表征

• 批准号: DP0344929
• 负责人: Prof Cheng Yan
• 金额: $ 32.54万
• 依托单位: Queensland University of Technology
• 依托单位国家: 澳大利亚
• 项目类别: Discovery Projects
• 财政年份: 2003
• 资助国家: 澳大利亚
• 起止时间: 2003-01-24 至 2008-12-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/DP0344929
• 关键词: Characterisation; soldered; adhesively; bonded; assemblies

Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability assessment. The outcomes of the project will fill the gap in the knowledge for characterising failure processes of these assemblies and provide effective methods and easy-to-use guidelines for reliability evaluation and life prediction of photonic packages, expanding and enhancing Australia's capacity in the areas.

光子封装在新光学技术的发展中发挥着关键作用。该项目旨在建立表征光子封装焊接和粘合组件完整性的理论和技术。将研究关键失效机制，并使用人工神经网络（ANN）方法建立复杂的寿命预测模型进行可靠性评估。该项目的成果将填补表征这些组件故障过程的知识空白，并提供有效的方法和易于使用的指南 用于光子封装的可靠性评估和寿命预测，扩大和增强澳大利亚在该领域的能力。