Study on Thermal Fatique Life Prediction of Micro Soldered Joints

微焊点热疲劳寿命预测研究

• 批准号: 09450044
• 负责人: EBIHARA Yoshinori
• 金额: $ 8.51万
• 依托单位: Tokyo Gakugei University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1997
• 资助国家: 日本
• 起止时间: 1997 至 1999
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-09450044/
• 关键词: Substrate; Solder; Fatigue Life Evaluation; Creep; Crack Initiation Life; Cyclic Bending; Fracture Life; Manson-Coffin's Law; クリープ; 有限要素法; 破断寿命; き裂発生寿命; 基板くり返しそり変形; ボールグリッドアレイパッケージ; 温度サイクル; 要素分割; ぬれ; 疲労強度; 繰り返しそり変形

Torsional fatigue tests and creep tests were carried out on a 60Sn-40Pb solder. In both tests three temperatures (303-333K) were used, and in the fatigue test five cycling frequencies (0.001-5.0Hz) were used. An evaluation method for the solder fatigue life under relatively high temperature or low cycling frequency was proposed from the test results, nothing that the characteristics of fatigue under the above mentioned conditions were similar to the creep characteristics. Furthermore, this evaluation method was applied to the estimation of the crack initiation life of through-hole-type joints. By comparing the estimated values with the experimental ones it was clarified that this method was valid for the assessment of the crack initiation life of solder joints.To predict the fatigue life of soldered joints owing to the cyclic bending of the substrates when carrying movable electronic equipments, we conducted the fatigue tests by bending the substrates cyclically. As a result of the fatigue tests, it was shown that the fracture life was predicted well by Manson-Coffin's law using the equivalent plastic strain ranges as parameters and the life prediction equation was determined. Furthermore, the easier prediction method that the fracture life was about five times the crack initiation life was obtained.Finally, the state of the art of the research on fatigue life prediction of micro soldered joints was reported.

对 60Sn-40Pb 焊料进行扭转疲劳试验和蠕变试验。在这两项测试中，使用了三种温度（303-333K），在疲劳测试中，使用了五种循环频率（0.001-5.0Hz）。根据试验结果，提出了在较高温度或较低循环频率下焊接疲劳寿命的评价方法，但上述条件下的疲劳特性与蠕变特性相似。此外，该评估方法还应用于通孔型接头裂纹萌生寿命的估算。通过将估计值与实验值进行比较，表明该方法对于评估焊点的裂纹萌生寿命是有效的。 预测承载可移动电子设备时基板循环弯曲导致的焊点疲劳寿命，我们通过循环弯曲基材进行疲劳测试。疲劳试验的结果表明，使用等效塑性应变范围作为参数，曼森-柯芬定律可以很好地预测断裂寿命，并确定了寿命预测方程。此外，还得到了断裂寿命约为裂纹萌生寿命5倍的更简单的预测方法。最后，报告了微焊接接头疲劳寿命预测的研究现状。

项目成果

海老原理徳: "各種電子機器の実装技術と信頼性"エレクトロニクス実装学会編2010年までのエレクトロニクス実装の信頼性技術. 3-16 (1999)

海老原则之：《各种电子设备的安装技术和可靠性》电子封装协会编，电子封装的可靠性技术截至2010年。3-16（1999）

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K. Kaminishi 等人：“表面安装型微电子焊点中疲劳裂纹萌生和延伸寿命的评估”Trans。

Y. Ebihara et al.: "Fatigue Strength Evaluation to BGA Package Solder Joints"J. of Japan Institute of Electronics Packaging. Vol. 1, No. 1. 53-57 (1998)

Y. Ebihara 等人：“BGA 封装焊点的疲劳强度评估”J。

種田元治、上西研、本廣誠二: "クリープ特性を基にしたはんだのクリープ疲労寿命評価法"日本機械学会論文集A編. 第64巻 第617号. 50-57 (1998)

Motoharu Taneda、Ken Uenishi、Seiji Motohiro：“基于蠕变特性的焊料蠕变疲劳寿命的评价方法”日本机械工程学会会刊，卷 A，卷 64，第 617 期，50-57（1998 年）

M. Taneda et al.: "Creep-Fatigue Life Evaluation of Solder Based on Creep Characteristics"Trans. Of the Japan Society of Mechanical Engineers (A). Vol. 64, No. 617. 50-57 (1998)

M. Taneda 等：“基于蠕变特性的焊料蠕变疲劳寿命评估”Trans。