Fatigue Characteristics of Silicon Micromechanism for Micromachine

微机械用硅微机构的疲劳特性

• 批准号: 11650100
• 负责人: TSUJI Hirokazu
• 金额: $ 1.41万
• 依托单位: Tokyo Denki University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11650100/
• 关键词: Micromachine; Micromechanism; Fatigue; Micromaterial; Fatigue test; Single-crystalline silicon; Anisotropy etching

Elastic deformation of the microstructure such as an elasticity hinge was used for a movable mechanism of MEMS.The fabrication process of the microstructure often yielded the stress concentration. Static and fatigue strength are evaluated for notched type specimens fabricated from silicon wafers by micromachining, that is, PVD and the photo-etching processes. Results are summarized as follows :1. A micromaterial testing machine is developed for four points bending under statically and cyclic loading. An algorithm for the computer image processing to measure the specimen deformation is improved.2. Limitation between the loading frequency and deformation of the specimen is examined base on the energy law. Maximum frequency experimentally obtained under the fatigue test is half of the theory.3. An anisotropy etching has been applied to single crystalline silicon and V-groove is introduced. From the SEM observation a notch root has a radius of sub-micron order.4. It is found that the static strength of the notched specimen can be evaluated by the stress intensity factor, except for the extremely shallow notch.5. Fatigue test for 10^6 cycles is done for notched specimen, however no change is observed around the root of the notch.

微观结构（例如弹性铰链）的弹性变形用于MEM的可移动机理。微结构的制造过程通常会产生应力浓度。通过微加工（即PVD和光蚀刻过程）评估了用硅晶片制成的缺口类型的静态和疲劳强度。结果总结如下：1。在静态和循环负载下开发了四个点弯曲的微材料测试机。改进了计算机图像处理以测量样品变形的算法。2。载荷频率和样品变形之间的限制基于能量法。在疲劳检验下实验获得的最大频率是理论的一半。3。各向异性蚀刻已应用于单晶硅，并引入了V-Grove。从SEM观测值中，Notch根的半径为subicron Order.4。已经发现，除了极浅的凹槽5，可以通过应力强度因子评估缺口标本的静态强度。5。对凹口样品进行了10^6个周期的疲劳测试，但是在缺口的根部周围没有观察到任何变化。

项目成果

日野、小森、辻: "微小材料の強度評価用V溝切欠き試験片の製作"日本機械学会材料力学部門講演会講演論文集. No.99-16. 61-62 (1999)

Hino、Komori 和 Tsuji：“用于微小材料强度评估的 V 形槽缺口测试件的制作”日本机械工程学会材料力学分部论文集第 99-16 号（1999 年）。

S.Hino, K.Komori, H.Tsuji: "Fabrication of V-notched specimen for strength evaluation of micromaterial"JSME Proceedings. No.99-16. 61-62 (1999)

S.Hino、K.Komori、H.Tsuji：“用于微材料强度评估的 V 型缺口样品的制作”JSME 论文集。

S.Hino, Y.Ishikawa, H.Tsuji: "Evaluation for bending strength of notched micro-specimen made of silicon"JSME Proceedings. No.000-2. 233-234 (2000)

S.Hino、Y.Ishikawa、H.Tsuji：“硅制缺口微型样品的弯曲强度评估”JSME 论文集。

日野宗明,小森克敏,辻裕一: "微小材料の強度評価用V溝切欠き試験片の製作"日本機械学会材料力学部門講演会講演論文集. No.99-16. 61-62 (1999)

Muneaki Hino、Katsutoshi Komori、Yuichi Tsuji：“用于微观材料强度评估的 V 形槽缺口测试件的制作”日本机械工程学会材料力学分部论文集第 99-16 号（1999 年）。

日野宗明,石川洋祐,辻裕一: "切欠き付きシリコン微小試験片の曲げ強度の評価"日本機械学会関東支部ブロック合同講演会講演論文集. No.000-2. 233-234 (2000)

Muneaki Hino、Yosuke Ishikawa、Yuichi Tsuji：“带有缺口的硅微型试验样品的弯曲强度的评估”日本机械工程学会关东分会联合讲座会议记录第 000-234 号（2000 年）。