PCB film application in injection molding

PCB薄膜在注塑中的应用

• 批准号: 543402-2019
• 负责人: Wawrow, Peter
• 金额: $ 1.82万
• 依托单位: St. Clair College
• 依托单位国家: 加拿大
• 项目类别: Applied Research and Development Grants - Level 1
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=681031
• 关键词: PCB; film; application; injection; molding

Flexible electronics/circuits enable the manufacturing of smaller products and complex circuitry. The ability to embed these flexible circuits into electronic device casings will increase their manufacturing benefits, making this challenging process in great demand globally. The goal of the proposed project is to develop a proof of concept and working prototype to demonstrate the company's embedded electronics manufacturing capabilities. Knowledge and expertise in designing and building the wireless circuit with a renewable energy source (the prototype) will be transferred from the research team to the company. St. Clair College researchers will benefit from applying electronic circuit knowledge and gain insight into this emerging and competitive field.

柔性电子/电路可以制造更小的产品和复杂的电路。将这些柔性电路嵌入电子设备外壳的能力将提高其制造效益，使这一具有挑战性的工艺在全球范围内受到巨大需求。拟议项目的目标是开发概念验证和工作原型，以展示公司的嵌入式电子制造能力。使用可再生能源设计和构建无线电路（原型）的知识和专业知识将从研究团队转移到公司。圣克莱尔学院的研究人员将受益于电子电路知识的应用，并深入了解这个新兴且竞争激烈的领域。