ダイヤモンドマイクロアレイ工具の創成と極微細加工に関する研究

金刚石微阵列工具创建及超精细加工研究

• 批准号: 17560094
• 负责人: TAKANO Noboru
• 金额: $ 2.11万
• 依托单位: University of Toyama
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2005
• 资助国家: 日本
• 起止时间: 2005 至 2006
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-17560094/
• 关键词: Diamond Array Tool; Silicon Mold; Anisotropic Etching; Polycrystalline Diamond; Reactive Ion Etching; Ultra Micro Machining

In this study, we developed a diamond micro milling tool for micro-to-nano scale machining. This tool is manufactured by attaching a diamond cutting edge to tip of rotational axis. The diamond cutting edge with various shapes named "diamond array tool" are fabricated by depositing polycrystalline diamond using CVD on silicon molds which are made by anisotropic wet etching of the single crystal silicon or by reactive ion etching. The cutting edge has various shapes, the former is pyramidal, the latter are square, semicircle, triangle and trapezoid etc. By using this micro milling tool to machining for single crystal silicon, metallic glass and acrylic resin, the chip of these materials was observed largely by SEM image. It was found that the micro milling tool was possible to machining with high efficiency and accuracy.

在这项研究中，我们开发了用于微型到纳米尺度加工的钻石微型铣削工具。该工具是通过将钻石切割边缘连接到旋转轴尖端来制造的。具有称为“钻石阵列工具”的各种形状的钻石切口是通过使用CVD沉积在硅霉菌上的多晶钻石来制造的，这些钻石是通过各向异性的单晶硅或反应性离子蚀刻来制成的。尖端具有各种形状，前者是锥体，后者是正方形，半圆，三角形和梯形等。通过将此微铣削工具用于单晶硅，金属玻璃和丙烯酸树脂的加工，这些材料的芯片是由SEM图像大量观察到的。发现微型铣削工具可以以高效率和准确性进行加工。