Analysis and modelling of microscale surface structuring through lapping (A09)

通过研磨对微尺度表面结构进行分析和建模 (A09)

• 批准号: 399777748
• 金额: --
• 依托单位: Lehrstuhl für Computational Physics in Engineering (CPE)
• 依托单位国家: 德国
• 项目类别: Collaborative Research Centres
• 财政年份: 2018
• 资助国家: 德国
• 起止时间: 2017-12-31 至 2022-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/399777748?language=en
• 关键词: Analysis; modelling; microscale; surface; structuring

The surface morphology during lapping results from complex interactions between the lapping grain kinematics, the influence of the lapping fluid and the material removal mechanism. These interactions are to be investigated experimentally and mapped numerically. First, a physical material removal model as well as basic models of the kinematics of angular grains and the fluid flow in narrow gaps will be developed, which finally will be coupled to a holistic lapping process model. Using the lapping simulation, parameter combinations for targeted microstructuring of the component surface can be determined and interactions can be analyzed.

拍子期间的表面形态是由于晶粒晶粒运动学，收获液的影响和材料去除机制之间的复杂相互作用引起的。这些相互作用将进行实验和数值映射。首先，将开发一个物理材料的去除模型以及角晶粒运动学的基本模型和狭窄间隙中的流体流量，最终将与整体绑带过程模型耦合。使用lapping仿真，可以确定用于组件表面的靶向微结构的参数组合，并可以分析相互作用。