SBIR Phase II: Innovative Two-Phase Cooling with Micro Closed Loop Pulsating Heat Pipes for High Power Density Electronics
SBIR 第二阶段:用于高功率密度电子产品的创新两相冷却微闭环脉动热管
基本信息
- 批准号:2321862
- 负责人:
- 金额:$ 97.84万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Cooperative Agreement
- 财政年份:2024
- 资助国家:美国
- 起止时间:2024-04-01 至 2026-03-31
- 项目状态:未结题
- 来源:
- 关键词:
项目摘要
The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is that it enables significantly enhanced cooling performance for consumer and embedded electronics of mobile devices in the worldwide race for more efficient products. Compared with the current state of the art, this project’s micro Closed-Loop Pulsating Heat Pipes (CLPHPs) will provide over 40% higher cooling capacity, increase battery life by more than 30%, and reduce electricity consumption by over 25%. It will be made of a recyclable material (aluminum) or ceramic with a new environmentally friendly working fluid inside. The primary source of revenue will be via product sales of CLPHP-based heat sinks to laptop OEMs and other OEMs, integrators, and end users. We anticipate entering the market in 2026/2027 for mainstream and gaming “thin and light” laptops and electronics with discrete GPUs and CPUs/processors requiring advanced cooling. CLPHPs provide a direct replacement for existing vapor chamber, heat pipe, and heatsink solutions for these devices. The main deliverable is to develop an industry-leading heat spreader- that operates passively, creating its coolant flow from its self-pulsating mechanism, critical for thin mobile electronics for which fans or other auxiliary powered non-passive solutions are avoided. This SBIR Phase II project proposes to address the urgent cooling challenges presented by next-generation 5G/6G mobile devices and other advanced electronics (Artificial Intelligence, Internet of Things) for which a solution has yet to be found. The objectives are to build on the fundamental and practical knowledge developed in the Phase I project to geometrically enhance the micro-channels to increase the internal surface area, the evaporation and condensation processes, and the flow rate to achieve even greater heat-spreading capability. This will be accomplished through fabricating and testing two novel CLPHP designs (generations 2 and 3) under various heating conditions and orientations representative of mobile device applications. The goal is to enter the market with this disruptive cooling technology that will enhance the performance of millions of mobile devices, save battery/grid energy, and unlock the barriers created by today’s lack of advanced cooling solutions. The novel CLPHP is an important “enabler” of numerous new devices yet to be conceived and for improvement of existing advanced technologies, nearly all of which are electronically “throttled” by the limiting performance of current cooling technologies. This project is well-positioned to provide the US/worldwide market with the needed cooling solutions.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
该小型企业创新研究 (SBIR) 第二阶段项目的更广泛影响/商业潜力在于,与当前的更高效产品相比,它可以在全球范围内显着提高消费电子和移动设备嵌入式电子产品的冷却性能。该项目的微型闭环脉动热管 (CLPHP) 将提供超过 40% 的冷却能力,将电池寿命延长 30% 以上,并减少 25% 以上的电力消耗。主要收入来源将是通过向笔记本电脑原始设备制造商和其他原始设备制造商、集成商和最终用户销售基于 CLPHP 的散热器。 2026/2027 年,主流和游戏“轻薄”笔记本电脑和电子设备需要先进的冷却技术,配备独立 GPU 和 CPU/处理器,可以直接替代现有的 Vapor。这些设备的腔室、热管和散热器解决方案的主要成果是开发一种行业领先的散热器,该散热器被动运行,通过其自脉动机制产生冷却剂流,这对于使用风扇或其他设备的薄型移动电子产品至关重要。该 SBIR 第二阶段项目旨在解决下一代 5G/6G 移动设备和其他先进电子设备(人工智能、物联网)带来的紧迫冷却挑战。尚未找到解决方案,其目标是建立在第一阶段项目中开发的基础和实践知识的基础上,以几何方式增强微通道,以增加内部表面积、蒸发和冷凝过程以及流速。这将通过在代表移动设备应用的各种加热条件和方向下制造和测试两种新颖的 CLPHP 设计(第 2 代和第 3 代)来实现。将要提高数百万移动设备的性能,节省电池/电网能源,并消除当今缺乏先进冷却解决方案所造成的障碍。新颖的 CLPHP 是众多尚未构思的新设备和改进现有设备的重要“推动者”。先进技术,几乎所有这些技术都受到当前冷却技术性能限制的电子“限制”。该项目处于有利地位,可以为美国/全球市场提供所需的冷却解决方案。该奖项反映了 NSF 的法定使命,并被视为。值得通过使用基金会的智力优势和更广泛的影响审查标准进行评估来提供支持。
项目成果
期刊论文数量(0)
专著数量(0)
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会议论文数量(0)
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Victor Chiriac其他文献
Victor Chiriac的其他文献
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{{ truncateString('Victor Chiriac', 18)}}的其他基金
STTR Phase I: Innovative Two-Phase Cooling with Micro Closed Loop Pulsating Heat Pipes for High Power Density Electronics
STTR 第一阶段:用于高功率密度电子产品的创新两相冷却微闭环脉动热管
- 批准号:
2124797 - 财政年份:2021
- 资助金额:
$ 97.84万 - 项目类别:
Standard Grant
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