FuSe-TG: Open, Multiscale, Application-Agnostic Platform for Heterogeneous System-in-Package Co-Design

FuSe-TG：开放、多尺度、与应用无关的异构系统级封装协同设计平台

• 批准号: 2235414
• 负责人: Dan Jiao
• 金额: $ 55万
• 依托单位: Purdue University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-04-01 至 2025-03-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2235414&HistoricalAwards=false
• 关键词: FuSe; TG; Open; Multiscale; Application

Heterogeneous integration (HI) has shown tremendous potential to overcome the cost and performance challenges of advanced monolithic integration technology and effectively combat the slow-down of Moore’s law. However, HI constitutes a grand challenge in engineering since it must simultaneously address the electrical, optical, thermal, mechanical, and material challenges of integrating separately manufactured/designed components into a higher-level System-in-Package (SiP), for a diverse range of technologies. Currently, the design and optimization of functional blocks and chips are implemented in different domains without self-consistent links between different models, and without co-design or co-optimization between them. This project, if successful, will translate to sustained innovations in the microelectronics industry at-large and permit the US to maintain global leadership in microelectronics, delivering systems that achieve more-than-Moore scaling for years to come. This teaming project will help meet the future workforce needs in microelectronics, utilizing the Nation’s First Semiconductor Degrees Program (SDP) just launched at Purdue University. The project will leverage partnerships with U of Central Florida, UC Santa Barbara, and UC San Diego, all minority-serving institutions to attract underrepresented students, and will also partner with Community Colleges to develop training programs.The technical objective of this teaming effort is to break the barriers across applications, design domains, and abstraction levels, in modeling, simulation, optimization, and design through an open-source, multiscale, application-agnostic platform (Open-MAP) for heterogeneous SiP co-design. Open-MAP encompasses three key components: (1) A multiscale multiphysics modeling and analysis seamlessly integrated with either first-principles accuracy or a user-desired level of accuracy, which is further enriched by data, ML-assisted, and uncertainty quantification techniques; (2) A suite of multiphysics-informed design and optimization tools to automate co-design from intent to fabrication; (3) A series of co-design projects that will be conducted to identify critical barriers to co-design, for informing and guiding the development of Open-MAP, and eventually demonstrating the co-design advantages using the Open-MAP capabilities.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

异质整合（HI）表现出巨大的潜力，可以克服先进的整体整合技术的成本和性能挑战，并有效地打击摩尔定律的慢速下降。但是，HI在工程方面构成了巨大的挑战，因为它必须同时解决将单独制造/设计/设计的组件集成到高级包装（SIP）中的电气，光学，热，机械和物质的挑战，该挑战是针对潜水员的技术范围的。当前，功能块和芯片的设计和优化是在不同模型之间没有自洽链接的不同域中实现的，并且它们之间没有共同设计或合作式化。如果成功的话，该项目将转化为微电子行业的持续创新，并允许美国在微电子方面保持全球领导能力，从而实现以下几年来实现超过摩尔扩展的系统。该团队项目将利用刚刚在普渡大学（Purdue University）启动的美国第一个半导体学位课程（SDP）来帮助满足微电子的未来劳动力需求。 The project will leverage partnerships with U of Central Florida, UC Santa Barbara, and UC San Diego, all minority-serving institutions to attract underrepresented students, and will also partner with Community Colleges to develop training Programs.The technical objective of this teaming effort is to break the barriers across applications, design domains, and abstraction levels, in modeling, simulation, optimization, and design through an open-source, multiscale,用于异质SIP共同设计的应用程序 - 敏捷平台（开放型映射）。开放映射包括三个关键组成部分：（1）多尺度多物理学建模和分析与第一原理准确性或用户呈现的准确性水平无缝集成，这进一步由数据，ML辅助和不确定性量化技术进一步丰富； （2）一套多物理知识的设计和优化工具，可自动设计从意图到制造的共同设计； (3) A series of co-design projects that will be conducted to identify critical barriers to co-design, for informing and guiding the development of Open-MAP, and eventually demonstrating the co-design advantages using the Open-MAP capabilities.This award reflects NSF's statutory mission and has been deemed honestly of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.