I-Corps: Microscale Selective Laser Sintering Process

I-Corps：微型选择性激光烧结工艺

• 批准号: 2140503
• 负责人: Michael Cullinan
• 金额: $ 5万
• 依托单位: University of Texas at Austin
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-08-01 至 2023-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2140503&HistoricalAwards=false
• 关键词: Corps; Microscale; Selective; Laser; Sintering

The broader impact/commercial potential of this I-Corps project is to enable fabrication of high-density, high-aspect-ratio, freeform 3-dimentional (3D_ microscale interconnect structures at rates up to three times faster than existing technologies. This new commercial capability may have far-reaching implications due to the significant demand for new advanced packaging technologies for integrated circuits. The microscale, selective, laser sintering system has the potential to lower the cost of consumer and business facing products such as cloud web services and mobile computing while enabling new high-performance embedded applications such as self-driving vehicle technology, radiation-hard and high-acceleration sensing, and internet-connected medical devices. This technology may also potentially enable new packaging architectures not possible using current state-of-the-art fabrication techniques, increasing the design freedom of integrated circuit architects and enabling new technologies and applications.This I-Corps project further develops a microscale selective sintering process. In this process a layer of nanoparticle ink is coated using a slot-die coater and shuttled to the optical subsystem using a long-range custom air-bearing stage. There, a laser is focused through a digital micromirror device to sinter the nanoparticles into the desired pattern. After the first layer is sintered, the air-bearing stage translates the substrate back under the coater for the deposition of the next layer. The process of deposition, transfer and sintering is then repeated, building the 3D part. The research focuses on improving the current capabilities of the subsystems within the proof-of-concept prototype tool and the developing computational models along with materials/thermal measurements to understand the nanoscale physics within the microscale selective sintering process. Previous work has demonstrated fabrication of 3D metal structures with feature sizes of less than 5 microns and aspect ratios of greater than 20 to 1.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该I-Corps项目的更广泛的影响/商业潜力是为了制造高密度，高度高素质，自由形式的3维（3D_微观互连结构的速度，其比现有技术的速度比现有技术快三倍。这种新的商业能力可能具有对新的高级包装技术的高度含义。降低诸如云网络服务和移动计算之类的消费者和业务的成本，同时启用新的高性能嵌入式应用程序，例如自动驾驶汽车技术，辐射速度和高速加速感应感，以及使用互联网连接的医疗设备，还可以使用现有的架构架构，并启用了互联网连接的医疗设备。应用程序。该I-Corps项目进一步开发了微观的选择性烧结过程。 在此过程中，使用插槽-DIE夹具将纳米颗粒墨水覆盖，并使用远程自定义空气阶段将其穿梭到光学子系统。在那里，激光通过数字微龙设备聚焦，以将纳米颗粒烧碎到所需的图案中。在烧结第一层之后，空气阶段将基材转换回夹具下方的下一层沉积。然后重复沉积，转移和烧结的过程，建立3D部分。该研究的重点是提高概念概念原型工具和开发计算模型中子系统的当前功能以及材料/热测量结果，以了解微观选择性刺激过程中的纳米级物理。 先前的工作证明了3D金属结构的制造，其特征大小少于5微米，宽高比大于20至1。该奖项反映了NSF的法定任务，并且使用基金会的智力优点和更广泛的影响审查标准，被认为值得通过评估。