STTR Phase I: Innovative Two-Phase Cooling with Micro Closed Loop Pulsating Heat Pipes for High Power Density Electronics
STTR 第一阶段:用于高功率密度电子产品的创新两相冷却微闭环脉动热管
基本信息
- 批准号:2124797
- 负责人:
- 金额:$ 25.6万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2021
- 资助国家:美国
- 起止时间:2021-11-15 至 2023-06-30
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The broader impact/commercial potential of this Small Business Technology Transfer (STTR) Phase I project is the development of improved thermal cooling solutions for mobile devices. Cooling solutions today are often unable to meet the demands of 5G/6G telecommunications with thermal heating rates up to 10 times that of 4G technologies. Even current high performance 5G mobile phones have greatly increasing thermal loads, which, in turn, increase the external touch temperature of the smart phone and often trigger the phone to slow down its speed. The proposed technology may result in improved cooling for increased performance without limitations of performance throttling. Enhancing thermal cooling capabilities of cutting edge mobile devices may help enable widespread adoption of 5G/6G telecommunications, virtual and augmented reality, artificial intelligence, self-driving cars, and big data applications.This Small Business Technology Transfer (STTR) Phase I project develops a new passive micro-two-phase cooling based on pulsating heat pipes, which consist of a loop of microchannels in a flat plate in which oscillations of the coolant in the serpentine are generated by vapor bubbles to pump liquid and vapor to transport higher heat loads. The design harnesses complex self-induced pulsations to better perform the work of transferring larger quantities of heat by enhancing the pulsating heat pipe's fluid motion with localized obstructions to create distributed bubble nucleation points. The same obstructions will be used to improve the micro-thermal heat transfer processes. The project introduces microfluidics to pulsating heat pipes. The research objectives of the proposed project are to demonstrate substantial improvements in thermal performance compared to competing cooling technology (vapor chambers) at the same thin form factors.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
该小型企业技术转移(STTR)I期项目的更广泛的影响/商业潜力是开发改进的移动设备的热冷却解决方案。 当今的冷却溶液通常无法满足5G/6G电信的需求,热加热速率的最高为4G技术的10倍。即使是当前的高性能5G手机,热负载也大大增加了,这又会增加智能手机的外部触摸温度,并经常触发手机降低其速度。提出的技术可能会改善冷却,以提高性能,而不会限制性能节流。 Enhancing thermal cooling capabilities of cutting edge mobile devices may help enable widespread adoption of 5G/6G telecommunications, virtual and augmented reality, artificial intelligence, self-driving cars, and big data applications.This Small Business Technology Transfer (STTR) Phase I project develops a new passive micro-two-phase cooling based on pulsating heat pipes, which consist of a loop of microchannels in a flat plate in潮汐气泡产生的冷却液的振荡是通过蒸气气泡泵送液体和蒸气以运输较高的热负荷的。 该设计利用复杂的自我诱导的脉动来更好地执行通过用局部障碍物增强脉动热管的流体运动来转移大量热量的工作,从而产生分布式气泡成核点。相同的障碍物将用于改善微热传热过程。该项目将微流体引入脉动热管。 拟议项目的研究目标是证明与竞争性冷却技术(蒸气室)相同的薄型形式相比,热性能的实质性改善。该奖项反映了NSF的法定任务,并被认为是值得通过基金会的知识优点和更广泛的影响审查标准来评估的。
项目成果
期刊论文数量(0)
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Victor Chiriac其他文献
Victor Chiriac的其他文献
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{{ truncateString('Victor Chiriac', 18)}}的其他基金
SBIR Phase II: Innovative Two-Phase Cooling with Micro Closed Loop Pulsating Heat Pipes for High Power Density Electronics
SBIR 第二阶段:用于高功率密度电子产品的创新两相冷却微闭环脉动热管
- 批准号:
2321862 - 财政年份:2024
- 资助金额:
$ 25.6万 - 项目类别:
Cooperative Agreement
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