MRI: Acquisition of a Photonic Nanofabrication System

MRI：获取光子纳米加工系统

• 批准号: 2018853
• 负责人: Daewon Kim
• 金额: $ 52.36万
• 依托单位: Embry-Riddle Aeronautical University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2020
• 资助国家: 美国
• 起止时间: 2020-08-01 至 2023-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2018853&HistoricalAwards=false
• 关键词: MRI; Acquisition; Photonic; Nanofabrication; System

This Major Research Instrumentation (MRI) award supports the acquisition of a photonic nanofabrication system that enables three-dimensional fabrication of nanoscale to mesoscale structures with ultrahigh print resolution. This instrument will catalyze, potentially transformative fundamental research at Embry-Riddle Aeronautical University in areas ranging from soft robotics and sensors/actuators to cellular and lattice structures--enabling societal advances in areas from precision surgery and biomedical devices to manufacturing and warehouse distribution. This instrument will be a major regional resource for nanofabrication research and training and it will enhance Embry-Riddle’s collaborations with other universities, research centers, and industries. The award will also support educational activities for K-12, undergraduate and graduate students, and the public-- significantly impacting diverse populations of all ages and backgrounds.Recent advances in additive manufacturing provide an opportunity to design and fabricate complex microstructures with unconventional geometries and materials for a wide range of engineering applications. This instrument will enable fabrication of biofidelic and biomimetic scaffolds and micromechanical and microfluidic devices to study biochemical processes and cancer research. Key projects will advance fundamental understanding in key areas including- electromechanical relationships between micro dielectric elastomer and compliant electrodes of soft robotic actuation and knowledge of how muscular hydrostatic actuation works.- relationships between the optimized microstructure geometries and mechanical properties and number of cells in 3D-printed micro lattice cellular structures.- 3D geometries that offer better loss for guided waves or improved antenna radiation and optimal dielectric interconnections that are enabled by a 3D polymer structure.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该重大研究仪器 (MRI) 奖项支持收购光子纳米制造系统，该系统能够以超高打印分辨率三维制造纳米级到介观级结构，该仪器将促进安柏里德航空大学在各个领域的潜在变革性基础研究。从软机器人和传感器/执行器到细胞和晶格结构——推动从精密手术和生物医学设备到制造和仓库配送等领域的社会进步。该奖项还将支持 K-12 学生、本科生和研究生以及公众的教育活动，对不同人群产生重大影响。增材制造的最新进展为设计和制造具有非常规几何形状和材料的复杂微结构提供了机会，可用于广泛的工程应用。用于研究生化过程和癌症研究的支架和微机械和微流体装置，重点项目将促进对关键领域的基本理解，包括：微介电弹性体和软机器人驱动的顺应电极之间的机电关系，以及肌肉静水驱动如何工作的知识。优化的微结构几何形状和机械性能以及 3D 打印微晶格蜂窝结构中的单元数量。- 3D 几何形状可提供更好的导波损耗或改进的天线辐射该奖项反映了 NSF 的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

Microlens Coupler from Integrated Photonic Circuit to Fiber Design for Space Application

从集成光子电路到空间应用光纤设计的微透镜耦合器

• 发表时间: 2024-01
• 期刊: IEEE Space Hardware and Radio Conference
• 作者: Xu, Chengtao;Shivakumar, Jayaprakash B.;Rojas
• 通讯作者: Rojas

Additive Manufacturing of Photocurable PVDF-Based Capacitive Sensor

基于光固化 PVDF 的电容式传感器的增材制造

• DOI: 10.1115/smasis2023-111151
• 发表时间: 2023-09
• 期刊: American Society of Mechanical Engineers
• 作者: Srinivasaraghavan Govindarajan, Rishikesh;Ren, Zefu;Madiyar, Foram;Kim, Daewon
• 通讯作者: Kim, Daewon

Electrode filling using capillary action of 3D printed elastomer microchannels

利用 3D 打印弹性体微通道的毛细管作用填充电极

• DOI: 10.1117/12.2658146
• 发表时间: 2023-04
• 期刊: SPIE
• 作者: Stark, Taylor;Kim, Daewon
• 通讯作者: Kim, Daewon

Flexible Piezoelectric Wave-Based Sensor: Numerical Analysis And Validation

基于柔性压电波的传感器：数值分析和验证

• DOI: 10.1115/smasis2022-91069
• 发表时间: 2022-09
• 期刊: American Society of Mechanical Engineers
• 作者: Srinivasaraghavan Govindarajan, Rishikesh;Madiyar, Foram;Kim, Daewon
• 通讯作者: Kim, Daewon

Piezoelectric strain sensor through reverse replication based on two-photon polymerization

基于双光子聚合的反向复制压电应变传感器

• DOI: 10.1117/12.2630955
• 发表时间: 2022-04-18
• 期刊: 2022 18th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)
• 作者: Rishikesh Srinivasaraghavan Govindarajan;T. Stark;Stanislav Sikulskyi;F. Madiyar;Daewon Kim
• 通讯作者: Daewon Kim