CI-New: Collaborative Research: Modeling the Next-Generation Hybrid Cooling Systems for High-Performance Processors

CI-New：协作研究：为高性能处理器建模下一代混合冷却系统

• 批准号: 1730003
• 负责人: Sherief Reda
• 金额: $ 23.2万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-07-01 至 2021-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1730003&HistoricalAwards=false
• 关键词: CI; New; Collaborative; Research; Modeling

Design of future high-performance chips is hindered by severe temperature challenges. For example, existing cooling mechanisms cannot efficiently cool the extremely high power densities that are expected in exascale systems. Emerging cooling technologies, which may address these temperature challenges, are not easily accessible for experimentation to computer engineers. In fact, there is a substantial lag before a cooling technology becomes available for system design and optimization. Such lags cause design quality to be left on the table. To this end, this project proposes a software infrastructure that enables accurate modeling of cutting-edge cooling methods and that facilitates mutually customizing the computing and cooling systems to dramatically push system energy efficiency. The proposed infrastructure is a system-level design automation tool that includes compact thermal models of emerging cooling methods (thermoelectric coolers, two-phase cooling with microchannels or nanopores, phase-change materials, and single-phase liquid cooling). The project plan includes (1) synthesizing novel device-level models into compact representations; (2) using measurements on prototypes for validation of the proposed models; and (3) developing automation tooling to co-design hybrid customized cooling subsystems together with a given computing system. The broader impact of the project will be to help advance computing beyond the limitations of Moore's Law by making efficient design of high-power-density systems possible. The proposed infrastructure will enable transformative research in design automation, computer architecture, and system design with emerging cooling technologies, particularly in the dimensions of performance, variability, energy, heterogeneity, and cross-layer design. The infrastructure will be released to the community as open source software. The interdisciplinary nature of the project creates ample opportunities for undergraduate projects and outreach programs for underrepresented groups and K-12 students.

未来高性能芯片的设计受到严峻的温度挑战的阻碍。例如，现有的冷却机制无法有效地冷却百亿亿次系统中预期的极高功率密度。新兴的冷却技术可以解决这些温度挑战，但计算机工程师不容易进行实验。事实上，冷却技术可用于系统设计和优化之前存在很大的滞后。这种滞后导致设计质量被搁置。为此，该项目提出了一种软件基础设施，可以对尖端冷却方法进行精确建模，并有助于相互定制计算和冷却系统，从而显着提高系统能效。所提出的基础设施是一个系统级设计自动化工具，包括新兴冷却方法的紧凑热模型（热电冷却器、微通道或纳米孔两相冷却、相变材料和单相液体冷却）。该项目计划包括（1）将新颖的设备级模型合成为紧凑的表示； (2) 使用原型测量来验证所提出的模型； (3) 开发自动化工具来共同设计混合定制冷却子系统与给定的计算系统。该项目更广泛的影响将是通过使高功率密度系统的高效设计成为可能，帮助推动计算超越摩尔定律的限制。拟议的基础设施将利用新兴冷却技术，实现设计自动化、计算机架构和系统设计方面的变革性研究，特别是在性能、可变性、能源、异构性和跨层设计方面。该基础设施将作为开源软件发布给社区。该项目的跨学科性质为本科项目和针对弱势群体和 K-12 学生的外展项目创造了充足的机会。

项目成果

Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

带微柱蒸发器的两相均热板：未来高性能芯片散热的新方法

• DOI: 10.1109/itherm.2019.8757412
• 发表时间: 2019-05
• 期刊: Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
• 作者: Yuan, Zihao;Vaartstra, Geoffrey;Shukla, Prachi;Said, Mostafa;Reda, Sherief;Wang, Evelyn;Coskun, Ayse K.
• 通讯作者: Coskun, Ayse K.

A Learning-Based Thermal Simulation Framework for Emerging Two-Phase Cooling Technologies

用于新兴两相冷却技术的基于学习的热仿真框架

• DOI: 10.23919/date48585.2020.9116480
• 发表时间: 2020-03
• 期刊: Design Automation and Test in Europe
• 作者: Yuan, Zihao;Vaartstra, Geoffrey;Shukla, Prachi;Lu, Zhengmao;Wang, Evelyn;Reda, Sherief;Coskun, Ayse K.
• 通讯作者: Coskun, Ayse K.

PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies

PACT：用于新兴集成和冷却技术的可扩展并行热模拟器

• DOI: 10.1109/tcad.2021.3079166
• 发表时间: 2022-04-01
• 期刊: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
• 影响因子: 2.9
• 作者: Zihao Yuan;Prachi Shukla;Sofiane Chetoui;Sean S. Nemtzow;S. Reda;A. Coskun
• 通讯作者: A. Coskun

LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency

LoCool：解决局部热点问题，提高系统能效

• DOI: 10.1109/tcad.2019.2902355
• 发表时间: 2020-04-01
• 期刊: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
• 影响因子: 2.9
• 作者: Fulya Kaplan;Mostafa Said;S. Reda;A. Coskun
• 通讯作者: A. Coskun