SBIR Phase II: Defect Mapping Instrument for Optimizing Wafer Manufacturing Process

SBIR 第二阶段：用于优化晶圆制造工艺的缺陷测绘仪器

• 批准号: 1430690
• 负责人: Araz Yacoubian
• 金额: $ 74.99万
• 依托单位: Ler Technologies
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-08-01 至 2016-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1430690&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Defect; Mapping

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is that it will benefit the semiconductor manufacturing industry by providing a metrology tool that increases yield and reduces manufacturing cost. This project develops a non-contact, non-destructive tool that enables rapid wafer scan, producing a subsurface defect map to locate and minimize defects during integrated circuit manufacturing. The end user will benefit from the lower cost of electronics resulting from increased yield. Environmental benefits include reduction of wasted wafers and associated materials and chemicals used during wafer processing. Other use of this technology is as a laboratory instrument, providing a new subsurface characterization tool to the scientific community. Semiconductors are ubiquitous in our lives and the trend towards making them (and the products which house them) faster, cheaper and smaller are clear. The industry is vocal in its need for testing equipment to keep up with this trend, but current technologies fall short.This Small Business Innovation Research (SBIR) Phase II project is to develop an inspection tool that is capable of detecting subsurface features and defects for semiconductors wafer inspection. In the wafers manufacturing, starting from the bare wafer, each step can lead to defects, which, if not detected, can lower yield and increase cost. Certain buried defects are not detectable using standard imaging techniques due to the presence of absorptive layers. This SBIR Phase II project describes a non-contact, non-destructive tool that utilizes an optical/acoustic technique that enables rapid wafer scan, producing a subsurface defect map to locate and minimize defects during integrated circuit manufacturing. Successful completion of the Phase II will lead to prototype work and commercialization.

这项小型企业创新研究（SBIR）II期项目的更广泛的影响/商业潜力是，它将通过提供一种计量工具来增加产量并降低制造成本，从而使半导体制造业的行业受益。该项目开发了一种非接触，无损的工具，可以进行快速晶圆扫描，从而产生地下缺陷图，以在集成电路制造过程中定位和最小化缺陷。 最终用户将受益于由于产量增加而导致的电子产品的较低成本。环境益处包括减少浪费的晶圆以及晶片加工过程中使用的相关材料和化学物质。该技术的其他用途是作为实验室工具，为科学界提供了一种新的地下表征工具。半导体在我们的生活中无处不在，以及使它们（以及容纳它们的产品）更快，更便宜和较小的趋势清晰。该行业的需求是测试设备以跟上这一趋势的需求，但是当前的技术不足。这项小型企业创新研究（SBIR）II期项目是开发一种能够检测地下功能和缺陷的检查工具半导体晶圆检查。 在晶圆制造中，从裸晶片开始，每个步骤都会导致缺陷，如果未检测到，则可以降低产量并增加成本。由于存在吸收层，使用标准成像技术无法检测到某些埋藏的缺陷。这个SBIR II期项目描述了一种非接触式，无损的工具，该工具利用了一种光学/声学技术，该技术可以快速晶片扫描，从而产生地下缺陷图以在集成电路制造过程中定位和最小化缺陷。 成功完成II期将导致原型工作和商业化。