GOALI: Development of Metallic MEMS Materials for Extreme Environments

目标：开发适用于极端环境的金属 MEMS 材料

• 批准号: 1410301
• 负责人: Kevin Hemker
• 金额: $ 42万
• 依托单位: Johns Hopkins University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-09-01 至 2018-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1410301&HistoricalAwards=false
• 关键词: GOALI; Development; Metallic; MEMS; Materials; GOALI; Development; Metallic; MEMS; Materials

Non-technical Summary: Over the past several decades micro-devices and microelectromechanical systems (MEMS) have found uses as ink jet printers, accelerometers, gyroscopes, pressure sensors, and digital light projectors and have become a multi-billion dollar industry. This study is motivated by the fact that a broader spectrum of MEMS materials would offer a wider range of functionality and fuel a greatly expanded assortment of MEMS applications. Elevated temperature MEMS devices are of particular interest in: aviation, automotive, power generation, sub-sea drilling, and chemical processing industries in which MEMS sensing and guidance in harsh environments would provide enhanced feedback and control. Metal MEMS alloys that offer: high density, electrical and thermal conductivity, strength, ductility and toughness; low cost; and fabrication routes for complex geometries would be especially attractive for these applications. But, highly engineered metallic alloys that can be sculpted with submicron resolution are currently not in the suite of available MEMS materials. For this reason, an interdisciplinary team from Johns Hopkins University (JHU) and General Electric Global Research (GEGR) has been formed to undertaking a collaborative program to develop Metal MEMS alloys for use as high temperature MEMS sensors and micro-switches. Extended internships at GEGR will provide students with an invaluable perspective on systems level materials integration. Participation in the SABES outreach program (an NSF-sponsored partnership between JHU and Baltimore City Public Schools) also provides the PI and his students with the chance to pay it forward by giving Baltimore elementary school students a unique perspective on STEM activities.Technical Summary:An interdisciplinary team from Johns Hopkins University (JHU) and General Electric Global Research (GEGR)is undertaking a collaborative program to develop metal MEMS alloys for high temperature MEMS sensors and micro-switches. The motivation for this collaboration lies in the desire to expand the MEMS material set beyond silicon to metallic alloys that can be deposited and shaped on the micro-scale and offer an attractive balance of properties: electrical and thermal conductivity, high density, low thermal expansion, strength, ductility, and toughness. The intellectual challenges to be addressed include the establishment of a science-based protocol for developing metal MEMS alloys that possess requisite physical and mechanical properties and can be used in extreme environments, e.g. temperatures of 300-500ºC for operational lifetimes exceeding one year. Candidate single- and multi-phase alloys have been identified and are being used to improve scientific understanding in five areas: (i) techniques for processing and shaping metallic alloys at the micro-scale, (ii) alloy design for dimensional stability, (iii) unique microstructure-mechanical property pathways and relations in alloys deposited far-from-equilibrium, (iv) thermal and mechanical drivers for microstructural evolution, and (v) integration of metal MEMS alloys into commercial applications. Fundamental processing-structure-properties studies at JHU have been designed to provide a foundation for concurrent GEGR efforts on the development of next-generation MEMS switches and sensors. Extended internships at GEGR are planned and will provide the visiting graduate student with an invaluable perspective on systems level materials integration. Moreover, participation in the SABES program (an established NSF-sponsored partnership between JHU and Baltimore City Public Schools) provides the PI and his students the chance to give Baltimore elementary school students a unique perspective on STEM research.

非技术摘要：在过去的几十年中，微设备和微电机电系统（MEMS）发现用作墨水打印机，加速度计，陀螺仪，压力传感器和数字灯光投影仪，并已成为千万亿美元的行业。这项研究的激励是，以下事实：更广泛的MEMS材料将提供广泛的功能，并为各种MEMS应用提供巨大扩展。温度升高的MEMS设备特别感兴趣：航空，汽车，发电，海底钻探以及化学加工行业，其中MEMS在Harmsh环境中的敏感性和指导将提供增强的反馈和控制。提供提供的金属MEMS合金：高密度，电导和热导率，强度，延展性和韧性；低成本;复杂几何形状的制造路线对于这些应用特别有吸引力。但是，可以用亚微米分辨率雕刻的高度工程的金属合金目前不在可用的MEMS材料套件中。因此，已经成立了约翰·霍普金斯大学（JHU）和通用全球研究（GEGR）的跨学科团队，以开发一项协作计划，以开发金属MEMS合金，以用作高温MEMS传感器和微型转换。 GEGR的扩展企业将为学生提供有关系统级材料集成的宝贵观点。 Participation in the SABES outreach program (an NSF-sponsored partnership between JHU and Baltimore City Public Sc​​hools) also provides the PI and his students with the chance to pay it forward by giving Baltimore elementary school students a unique perspective on STEM activities.Technical Summary:An interdisciplinary team from Johns Hopkins University (JHU) and General Electric Global Research (GEGR) is undertaking a collaborative program to develop metal MEMS高温MEMS传感器和微切口的合金。这种合作的动机在于渴望将硅材料从硅范围内扩展到金属合金，这些材料可以在微尺度上沉积和形状，并提供有吸引力的特性平衡：电气和导热率，高密度，低热量膨胀，强度，强度，强度，耐牙能和韧性。要解决的智力挑战包括建立基于科学的协议，以开发具有必要的物理和机械特性的金属MEMS合金，并可以在极端环境中使用，例如运营寿命的300-500ºC的温度超过一年。已经确定了候选单相和多相合金，并用于改善五个领域的科学理解：（i）在微尺度上处理和塑造金属合金的技术，（ii）尺寸稳定性的合金设计，（III）（iii）独特的微观结构属性属性途径和微型范围内的机能范围和关系，（IV）的机制，（IV）的机制（IV），（IV），（IV）（IV）（IV）（IV），（IV），IV（IV）；进化，（v）将金属mems合金整合到商业应用中。 JHU的基本处理结构 - 培训研究已旨在为GEGR在下一代MEMS开关和传感器的开发方面的同时努力提供基础。计划在GEGR进行扩展实习，并将为来访的研究生提供有关系统级材料集成的宝贵观点。此外，参加SABES计划（JHU和Baltimore City公立学校之间已建立的NSF赞助的合作伙伴关系）为PI和他的学生提供了使Baltimore小学学生对STEM研究的独特观点的机会。