Multiplexing Techniques for Scalable Wireless Interconnects at sub-THz Frequencies: Circuits-EM-Communication Codesign Approach

亚太赫兹频率可扩展无线互连的复用技术：电路-电磁-通信协同设计方法

• 批准号: 1408490
• 负责人: Kaushik Sengupta
• 金额: $ 30万
• 依托单位: Princeton University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-08-01 至 2018-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1408490&HistoricalAwards=false
• 关键词: Multiplexing; Techniques; Scalable; Wireless; Interconnects

Multiplexing Techniques for Scalable Wireless Interconnects at THz FrequenciesECCS-1408490PI: Kushik Sengupta, Princeton University This proposal aims to investigate and develop spatially multiplexed architectures for wireless interconnects at sub-THz frequencies as scalable, energy-efficient solution towards one terabit per second (1 Tb/s). As we enter the era of terra-scale computing, massive amounts of data crunching by these processors will require inordinately large amount of bandwidth, not currently served by either electrical or optical interconnect solutions. Current methods of scaling of electrical interconnects to higher data rates are either limited by the available bandwidth density (Gb/s/mm2), energy cost, the circuit complexities in driving high-speed data through the long and lossy physical traces, or by the maximum number of parallel physical traces possible to accommodate in a constrained form factor. Wireless interconnects near THz frequencies are promising , but wireless data rates of 10Gb/s and the high energy/bit requirement, falls way short of meeting the bandwidth requirements for future off-chip interconnects. In this proposal, we aim to investigate techniques where the capacity of the channel can be increased many-fold using communication theoretic spatial-domain multiplexing techniques. Under the same total power constraint, such architectures have orders of magnitude more channel capacity, thereby providing a scalable solution towards wireless Tb/s interconnects. A key component in this proposal is to combine seamlessly, high-frequency circuits and systems and antennas with communication-theoretic techniques to increase capacity and data-rates by orders of magnitude, not otherwise possible in a single directional partitioned approach. Metal-based interconnect traces on printed circuit boards(PCB) serve as the most common method of chip-chip interconnects. However, increasing need of computational power to crunch more and more data in specialized server systems, high-performance computing or even portable devices, requires that communication data-rate from the processor to the peripherals be scaled proportionately. In most cases, the number of input-output pins is limited by the form factor, which puts a bottleneck on communication capacity among all the processors. In this proposal, we investigate techniques to use very high-frequency electromagnetic waves located in the Terahertz portion of the spectrum (between microwaves and infra-red) to establish seamless wireless communication links among the chipsets. Moving to such high frequencies enables us to exploit orders of magnitude higher bandwidth needed for sustaining such high data rates. Additionally, we investigate techniques to increase the communication links capacity by another order through spatial multiplexing techniques in a short-range communication setting. The success of this project is envisioned to bring new forms of smart interconnect solutions for a host of various applications from high-performance computing to internet data centers. The results of this research effort are also expected to have major impact in advancing the field of THz electronics benefitting diverse applications such as imaging and sensing. In a broader vision, this will have major impacts in radically new technologies in communication and computation, which not only makes us a more connected society, but also fuel research in other areas of applied science. This research is also expected to train both graduate and undergraduate students in multi-disciplinary fields, which are vitally important for solving challenging research problems for the future.

可扩展无线互连的多路复用技术在thz pomencencieseccs-1408490pi：普林斯顿大学的Kushik Sengupta，该建议旨在调查和开发无线互连的无线互连架构，以作为可伸缩的，能源效能的溶液，朝着一个ter-ter-ter-ter-thz频率求解，朝着一个terabit/s s s terabit/ss s n tebiT/s s n t t terabit/s。当我们进入Terra级计算的时代时，这些处理器大量的数据处理将需要大量的带宽，目前不受电气或光学互连溶液的服务。电流互连到较高数据速率的当前方法要么受到可用的带宽密度（GB/S/MM2），能量成本，通过长而有损的物理痕迹驱动高速数据的电路复杂性，要​​么受到最大的平行物理痕量数量，以适应​​约束形式。无线互连在THZ频率附近是有希望的，但是无线数据速率为10GB/s，高能量/钻头需求，不足以满足未来芯片外互连的带宽要求。在此提案中，我们旨在调查使用通信理论空间塑料多路复用技术可以增加通道能力的技术。在相同的总功率约束下，此类架构的通道容量增加了数量级，从而为无线TB/S互连提供了可扩展的解决方案。该提案中的一个关键组成部分是将无缝的高频电路和系统和天线与通信理论技术相结合，以通过数量级来增加容量和数据速率，以其他方式在单个方向分配方法中不可能。印刷电路板（PCB）上的基于金属的互连轨迹是芯片芯片互连的最常见方法。但是，增加计算能力以在专用服务器系统，高性能计算甚至便携式设备中处理越来越多的数据，这要求将通信数据速率从处理器到外围设备进行成比例缩放。在大多数情况下，输入输出引脚的数量受外形元素的限制，这使所有处理器之间的通信能力瓶颈瓶颈。在此提案中，我们研究了使用位于光谱的Terahertz部分（微波和红外线之间）的高频电磁波的技术，以在芯片组之间建立无缝的无线通信链路。转移到如此高的频率使我们能够利用维持如此高数据速率所需的数量级的数量级。此外，我们调查了通过短期通信设置中的空间多路复用技术通过另一个订单来提高通信链路容量的技术。设想该项目的成功是为从高性能计算到互联网数据中心的许多应用程序带来新形式的智能互连解决方案。预计这项研究工作的结果还将在推动THZ电子领域的领域产生重大影响，从而使成像和传感等多样化的应用受益。在更广泛的愿景中，这将对沟通和计算的根本新技术产生重大影响，这不仅使我们成为一个更加联系的社会，而且还可以在应用科学的其他领域进行研究。这项研究还预计将在多学科领域培训研究生和本科生，这对于解决未来具有挑战性的研究问题至关重要。