US-Taiwan Planning VIsits: Novel Sensor Designs for Three-Dimensional Integrated Circuits

美台规划访问：三维集成电路的新型传感器设计

• 批准号: 1331332
• 负责人: Yiyu Shi
• 金额: $ 6.63万
• 依托单位: Missouri University of Science and Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-07-01 至 2015-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1331332&HistoricalAwards=false
• 关键词: US; Taiwan; Planning; VIsits; Novel

The goal of this CNIC proposal is to catalyze an international collaboration between Missouri University of Science and Technology (USA) and Industrial Technology Research Institute (Taiwan). The focus of the research effort is to design test chips along with silicon measurements to preliminarily demonstrate the efficacy of two novel sensor designs for three-dimensional integrated circuits (3D ICs): a temperature-stress co-sensor and a crack sensor. The former is the first-of-its-kind that avoids the conventional time-consuming sensor calibration process by self-calibrating based on the reciprocity between temperature and stress. The latter is the first-of-its-kind that detects cracks based on a single DC voltage measurement, which eliminates the need of conventional X-ray or other optical imaging equipment. Both sensors are small in size, which allows for massive on-chip deployment. 3D ICs are already available in the low-power embedded domain. In addition, low-power hand-held devices are expected to commercialize this technology in 2013-2014. There is also a significant interest from the high-performance computing domain on this technology. Moreover, the 3D IC industry is actively engaged in research and development activities to identify and overcome manufacturing challenges. However, little is known on what design and post-silicon technologies are available and required to improve thermo-mechanical reliability of 3D ICs. This collaborative research effort will initiate a new research direction to fill a critical gap that is delaying the mainstream acceptance of 3D IC technology. In addition, the proposed activities will expose the associated graduate student to international research experience; they will enable a solid long-term collaboration with ITRI; and they will provide US students with rich IC design knowledge from Taiwan?s semiconductor industry through webinars. This CNIC award is funded by the International Science and Engineering (ISE) section of the Office of International and Integrative Activities, with co-funding from the Communications, Circuits, and Sensing-Systems (ENG/CCSS).

该建议的目的是催化密苏里科学技术大学（美国）和工业技术研究所（台湾）之间的国际合作。研究工作的重点是设计测试芯片以及硅测量值，以初步证明两种新型传感器设计对三维集成电路（3D IC）的功效：一种温度触感的共同传感器和一个裂纹传感器。前者是基于温度和压力之间的互惠来自我校准，避免了常规的耗时传感器校准过程。后者是基于单个直流电压测量值检测裂缝的首先，这消除了常规X射线或其他光学成像设备的需求。这两个传感器的尺寸都很小，可以进行大规模的芯片部署。 3D IC已在低功率嵌入式域中可用。此外，预计低功率手持设备将在2013 - 2014年将这项技术商业化。高性能计算领域对这项技术也引起了重大兴趣。此外，3D IC行业正在积极从事研发活动，以识别和克服制造业的挑战。但是，对于提高3D IC的热机械可靠性，可以使用哪种设计和后硅技术，知之甚少。这项协作研究工作将启动一个新的研究方向，以填补一个关键的空白，这延迟了3D IC技术的主流接受。此外，拟议的活动将使相关研究生接触国际研究经验；他们将与ITRI实现坚实的长期合作；他们将通过网络研讨会为我们的学生提供来自台湾半导体行业的丰富设计知识。该CNIC奖由国际和综合活动办公室的国际科学与工程（ISE）部分资助，并从通信，电路和传感系统（ENG/CCSS）获得了共同资助。